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Discover 3,471 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Inquiry
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MOQ: 1 MPQ: 1
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GASKET BECU 15.24X457.2MM
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No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 18.000" (457.20mm) | 0.600" (15.24mm) | - | - | Slot | ||
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Laird Technologies EMI |
Inquiry
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-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 15.82X381MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | - | - | Rivet | ||
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Laird Technologies EMI |
Inquiry
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-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 25X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.400" (10.16mm) | 24.000" (609.60mm) | 0.980" (24.89mm) | - | - | Clip | ||
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Laird Technologies EMI |
7
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3 days |
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 6.6X609.6MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.260" (6.60mm) | - | - | Snap-In | ||
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Laird Technologies EMI |
Inquiry
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-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 15.82X381MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | Tin | 299.21μin (7.60μm) | Rivet | ||
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Laird Technologies EMI |
Inquiry
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-
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MOQ: 1 MPQ: 1
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GASKET BECU 28.7X304.8MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.410" (10.41mm) | 12.000" (304.80mm) | 1.130" (28.70mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Inquiry
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-
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MOQ: 1 MPQ: 1
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MF LOAD SERIES 1/4X12
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ECCOSORB | - | Fabric Over Foam | - | Round | - | 12.008" (305.00mm) | 0.250" (6.35mm) | - | - | - | ||
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Laird Technologies EMI |
Inquiry
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-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||
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Laird Technologies EMI |
Inquiry
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-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Unplated | - | Adhesive | ||
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Laird Technologies EMI |
Inquiry
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-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||
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Laird Technologies EMI |
Inquiry
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-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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Large Enclosure | 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 25.000 (7.62m) | 1.090" (27.69mm) | - | - | Hardware，Rivet，Solder | ||
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Laird Technologies EMI |
Inquiry
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-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | ||
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Laird Technologies EMI |
Inquiry
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-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Inquiry
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-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 12.7X609.6MM
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.500" (12.70mm) | - | - | Adhesive | ||
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Harwin Inc. |
Inquiry
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-
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MOQ: 1 MPQ: 1
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MINI RFI SHIELD CLIP 100/BAG
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EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | - | 0.088" (2.23mm) | 0.200" (5.08mm) | 0.042" (1.07mm) | Tin | 118.11μin (3.00μm) | Solder | ||
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Harwin Inc. |
Inquiry
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-
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MOQ: 1 MPQ: 1
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SMT PRESSURE CONTACT 1300/RL
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- | - | Shield Finger | - | - | 0.098" (2.50mm) | 0.138" (3.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
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Harwin Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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SMT PRESSURE CONTACT 1300/RL
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- | - | Shield Finger | - | - | 0.098" (2.50mm) | 0.138" (3.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
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Harwin Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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SMT PRESSURE CONTACT 1300/RL
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- | - | Shield Finger | - | - | 0.098" (2.50mm) | 0.138" (3.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
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Harwin Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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SMT PRESSURE CONTACT TIN 1300
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- | - | Shield Finger | - | - | 0.098" (2.50mm) | 0.138" (3.50mm) | 0.079" (2.00mm) | Tin | Flash | Solder |
