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		Image	Part Number	Manufacturer	Quantity	Delivery period	Unit Price	Buy	Description	Series	Operating Temperature	Material	Height	Length	Width	Plating	Plating - Thickness	Attachment Method
		Image	Part Number	Manufacturer	Quantity	Delivery period	Unit Price	Buy	Description	Series	Operating Temperature	Material	Height	Length	Width	Plating	Plating - Thickness	Attachment Method
			10-26UD-AU-16	Leader Tech Inc.	Inquiry	-	-	0.11 X 0.26 AU 16--10-26UD-AU-16 MOQ: 1 MPQ: 1	0.11 X 0.26 AU 16--10-26UD-AU-16	TechMESH	-55°C ~ 121°C	Beryllium Copper	0.110" (2.79mm)	16.000" (406.40mm)	0.260" (6.60mm)	Gold	Flash	Adhesive
			11-S-32AH-AU-16	Leader Tech Inc.	Inquiry	-	-	0.11 X 0.32 AU 16--11-S-32AH-AU- MOQ: 1 MPQ: 1	0.11 X 0.32 AU 16--11-S-32AH-AU-	-	-55°C ~ 121°C	Beryllium Copper	0.110" (2.79mm)	16.000" (406.40mm)	0.320" (8.13mm)	Gold	Flash	Adhesive
			14-37FS-BD-300""	Leader Tech Inc.	Inquiry	-	-	0.14 X 0.36 BD 300"--FOLDED SERI MOQ: 1 MPQ: 1	0.14 X 0.36 BD 300"--FOLDED SERI	-	-55°C ~ 121°C	Beryllium Copper	0.140" (3.56mm)	25.00 (7.62m)	0.370" (9.40mm)	Unplated	-	Adhesive
			3-23TV30-SN-300""	Leader Tech Inc.	Inquiry	-	-	0.03 X 0.08 SN 300--TWIST RIGHT MOQ: 1 MPQ: 1	0.03 X 0.08 SN 300--TWIST RIGHT	-	-55°C ~ 121°C	Beryllium Copper	0.030" (0.76mm)	25.00 (7.62m)	0.080" (2.03mm)	Tin	Flash	Adhesive
			6-34T-BD-300	Leader Tech Inc.	Inquiry	-	-	0.07 X 0.34 BD 300--6-34T-BD-300 MOQ: 1 MPQ: 1	0.07 X 0.34 BD 300--6-34T-BD-300	-	-55°C ~ 121°C	Beryllium Copper	0.070" (1.78mm)	25.00 (7.62m)	0.340" (8.64mm)	Unplated	-	Adhesive
			23-60FS-BD-400	Leader Tech Inc.	Inquiry	-	-	0.23 X 0.60 BD 400--FOLDED SERIE MOQ: 1 MPQ: 1	0.23 X 0.60 BD 400--FOLDED SERIE	-	-55°C ~ 121°C	Beryllium Copper	0.230" (5.84mm)	33.33 (10.16m)	0.600" (15.24mm)	Unplated	-	Adhesive
			25-109FSDS-SN-300""	Leader Tech Inc.	Inquiry	-	-	0.25 X 1.09 SN 300"--FOLDED SERI MOQ: 1 MPQ: 1	0.25 X 1.09 SN 300"--FOLDED SERI	-	-55°C ~ 121°C	Beryllium Copper	0.250" (6.35mm)	25.00 (7.62m)	1.090" (27.69mm)	Tin	Flash	Adhesive
			25-109FSDS-BD-300	Leader Tech Inc.	Inquiry	-	-	0.25 X 1.09 BD 300"--FOLDED SERI MOQ: 1 MPQ: 1	0.25 X 1.09 BD 300"--FOLDED SERI	-	-55°C ~ 121°C	Beryllium Copper	0.250" (6.35mm)	25.00 (7.62m)	1.090" (27.69mm)	Unplated	-	Adhesive
			25-78FS-BD-300	Leader Tech Inc.	Inquiry	-	-	0.25 X 0.78 BD 300"--FOLDED SERI MOQ: 1 MPQ: 1	0.25 X 0.78 BD 300"--FOLDED SERI	-	-55°C ~ 121°C	Beryllium Copper	0.250" (6.35mm)	25.00 (7.62m)	0.780" (19.81mm)	Unplated	-	Adhesive
			8-25FSC-BD-400	Leader Tech Inc.	Inquiry	-	-	0.08 X 0.25 BD 400--FOLDED SERIE MOQ: 1 MPQ: 1	0.08 X 0.25 BD 400--FOLDED SERIE	-	-55°C ~ 121°C	Beryllium Copper	0.080" (2.03mm)	33.33 (10.16m)	0.250" (6.35mm)	Unplated	-	Adhesive
			0C97052005	Laird Technologies EMI	Inquiry	-	-	AP COIL CDY PSA MOQ: 1 MPQ: 1	AP COIL CDY PSA	All-Purpose	121°C	Beryllium Copper	0.140" (3.56mm)	16.000" (406.40mm)	0.370" (9.40mm)	Cadmium + Yellow Chromate	299.21μin (7.60μm)	Adhesive

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