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Discover 2,413 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating - Thickness | Attachment Method | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
Inquiry
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 15.24X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.210" (5.33mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | - | Clip | ||||
Laird Technologies EMI |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 15.24X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.210" (5.33mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | - | Clip | ||||
Laird Technologies EMI |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 28.7X304.8MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.410" (10.41mm) | 12.000" (304.80mm) | 1.130" (28.70mm) | - | Adhesive | ||||
Laird Technologies EMI |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 10.67X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.420" (10.67mm) | - | Clip | ||||
Laird Technologies EMI |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 15.24X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.280" (7.11mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | - | Clip | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 15.24X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.280" (7.11mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | - | Clip | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 8.1X406.4MM
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No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.090" (2.29mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | - | Adhesive | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 5.1X609.6MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.170" (4.32mm) | 24.000" (609.60mm) | 0.195" (4.95mm) | - | Snap-In | ||||
Laird Technologies EMI |
Inquiry
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-
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MOQ: 1 MPQ: 1
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GASKET BECU 15.24X457.2MM
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No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 18.000" (457.20mm) | 0.600" (15.24mm) | - | Slot | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 15.82X381MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | - | Rivet | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 25X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.400" (10.16mm) | 24.000" (609.60mm) | 0.980" (24.89mm) | - | Clip | ||||
Laird Technologies EMI |
7
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3 days |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 6.6X609.6MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.260" (6.60mm) | - | Snap-In | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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MF LOAD SERIES 1/4X12
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ECCOSORB | - | Fabric Over Foam | - | Round | - | 12.008" (305.00mm) | 0.250" (6.35mm) | - | - | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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Large Enclosure | 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 25.000 (7.62m) | 1.090" (27.69mm) | - | Hardware,Rivet,Solder | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 12.7X609.6MM
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.500" (12.70mm) | - | Adhesive | ||||
TE Connectivity AMP Connectors |
16,000
|
3 days |
-
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MOQ: 1 MPQ: 1
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SHIELD FINGER 3525
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- | - | Shield Finger | - | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | - | Solder | ||||
TE Connectivity AMP Connectors |
16,671
|
3 days |
-
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MOQ: 1 MPQ: 1
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SHIELD FINGER 3525
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- | - | Shield Finger | - | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | - | Solder | ||||
Laird Technologies EMI |
3,251
|
3 days |
-
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MOQ: 1 MPQ: 1
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METAL FILM OVER FOAM CONTACTS
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- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Hourglass | 0.315" (8.00mm) | 0.276" (7.00mm) | 0.236" (6.00mm) | - | Solder | ||||
Laird Technologies EMI |
3,820
|
3 days |
-
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MOQ: 1 MPQ: 1
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METAL FILM OVER FOAM CONTACTS
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- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Hourglass | 0.315" (8.00mm) | 0.276" (7.00mm) | 0.236" (6.00mm) | - | Solder | ||||
Laird Technologies EMI |
3,820
|
3 days |
-
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MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
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- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Hourglass | 0.315" (8.00mm) | 0.276" (7.00mm) | 0.236" (6.00mm) | - | Solder |