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Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Operating Temperature Type Material Shape Height Length Width Plating Plating - Thickness Attachment Method
10115748-009RLF
Amphenol FCI
Inquiry
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MOQ: 1  MPQ: 1
ANTENNA 1.55H GXT PACKAG
- Shield Finger,Pre-Loaded Beryllium Copper Alloy - 0.061" (1.55mm) 0.137" (3.48mm) 0.059" (1.50mm) Gold Flash Solder
10118529-003RLF
Amphenol FCI
Inquiry
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MOQ: 1  MPQ: 1
ANTENNA 1.8H TI CU G/F P
- Shield Finger,Pre-Loaded Beryllium Copper Alloy - 0.071" (1.80mm) 0.134" (3.40mm) 0.024" (0.60mm) Gold Flash Solder
10118533-003RLF
Amphenol FCI
Inquiry
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MOQ: 1  MPQ: 1
ANTENNA 1.3H TI CU G/F P
- Shield Finger,Pre-Loaded Beryllium Copper Alloy - 0.051" (1.30mm) 0.137" (3.48mm) 0.059" (1.50mm) Gold Flash Solder
10123973-004RLF
Amphenol FCI
Inquiry
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MOQ: 1  MPQ: 1
SPRING CONTACT GOLD
- Shield Finger,Pre-Loaded Stainless Steel - 0.047" (1.20mm) 0.102" (2.60mm) 0.043" (1.10mm) Gold Flash Solder
10104319-009RLF
Amphenol FCI
Inquiry
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MOQ: 1  MPQ: 1
2.50MM HEIGHT UNIVERSAL CONTACT
- Shield Finger,Pre-Loaded Beryllium Copper Alloy - 0.098" (2.50mm) 0.192" (4.87mm) 0.039" (0.98mm) Gold Flash Solder
10118530-003RLF
Amphenol FCI
Inquiry
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MOQ: 1  MPQ: 1
ANTENNA 2.5H TI CU G/F P
- Shield Finger,Pre-Loaded Beryllium Copper Alloy - 0.098" (2.50mm) 0.192" (4.87mm) 0.050" (1.28mm) Gold Flash Solder
10118532-003RLF
Amphenol FCI
Inquiry
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MOQ: 1  MPQ: 1
ANTENNA 3.5H TI CU G/F P
- Shield Finger,Pre-Loaded Beryllium Copper Alloy - 0.138" (3.50mm) 0.197" (5.00mm) 0.055" (1.40mm) Gold Flash Solder
10118534-003RLF
Amphenol FCI
Inquiry
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MOQ: 1  MPQ: 1
SPRING CONTACT GOLD
- Shield Finger,Pre-Loaded Beryllium Copper Alloy - 0.061" (1.55mm) 0.137" (3.48mm) 0.059" (1.50mm) Gold Flash Solder
10103955-009RLF
Amphenol FCI
Inquiry
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MOQ: 1  MPQ: 1
1.80MM HEIGHT UNIVERSAL CONTACT
- Shield Finger,Pre-Loaded Beryllium Copper Alloy - 0.071" (1.80mm) 0.134" (3.40mm) 0.028" (0.70mm) Gold Flash Solder
10125000-009RLF
Amphenol FCI
Inquiry
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MOQ: 1  MPQ: 1
SPRING CONTACT GOLD
- Shield Finger,Pre-Loaded Beryllium Copper Alloy - 0.083" (2.10mm) 0.134" (3.40mm) 0.043" (1.10mm) Gold Flash Solder
4520PA51H00012
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
GK NICU PTAFG PU V0 SQ
- Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) Square 2.000" (50.80mm) 0.120" (3.05mm) 2.000" (50.80mm) - - Adhesive
10104321-009RLF
Amphenol FCI
Inquiry
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MOQ: 1  MPQ: 1
3.50MM HEIGHT UNIVERSAL CONTACT
- Shield Finger,Pre-Loaded Beryllium Copper Alloy - 0.138" (3.50mm) 0.197" (5.00mm) 0.043" (1.10mm) Gold Flash Solder
4053PA51H00044
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
GK NICU PTAFG PU V0 DSH
- Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) D-Shape 0.091" (2.30mm) 0.440" (11.18mm) 0.091" (2.30mm) - - Adhesive
4283AE51K00039
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
GK NICU NRS PU V0 DSH
- Fabric Over Foam Polyurethane Foam,Nickel-Copper Polyester (NI/CU) D-Shape 0.079" (2.00mm) 0.390" (9.91mm) 0.157" (4.00mm) - - -
4124AD01G00024
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
GK NICU NRSG NF V0 REC
- - - - - 0.240" (6.10mm) - - - -
4BP4KA51H00072GOG
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
51H SERIES CUSTOM
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1-1447360-1
TE Connectivity AMP Connectors
Inquiry
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MOQ: 1  MPQ: 1
SHIELDFINGER1410
- Shield Finger,Pre-Loaded Copper Alloy - 0.055" (1.40mm) 0.138" (3.50mm) 0.039" (1.00mm) Gold 1.967μin (0.05μm) Solder
1-1447360-1
TE Connectivity AMP Connectors
Inquiry
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MOQ: 1  MPQ: 1
SHIELDFINGER1410
- Shield Finger,Pre-Loaded Copper Alloy - 0.055" (1.40mm) 0.138" (3.50mm) 0.039" (1.00mm) Gold 1.967μin (0.05μm) Solder
1-1447360-1
TE Connectivity AMP Connectors
Inquiry
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MOQ: 1  MPQ: 1
SHIELDFINGER1410
- Shield Finger,Pre-Loaded Copper Alloy - 0.055" (1.40mm) 0.138" (3.50mm) 0.039" (1.00mm) Gold 1.967μin (0.05μm) Solder
4202PA51H00050
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
GK NICU PTAFG PU V0 DSH
- Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) D-Shape 0.118" (3.00mm) 0.500" (12.70mm) 0.252" (6.40mm) - - Adhesive