- Manufacturer：
-
- Operating Temperature：
-
- Type：
-
- Material：
-
- Shape：
-
- Height：
-
- Length：
-
- Width：
-
- Plating：
-
- Plating - Thickness：
-
- Selected conditions:
Discover 2,862 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
TE Connectivity AMP Connectors |
10,664
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 3014 LOW FORCE
|
- | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.118" (3.00mm) | 0.055" (1.40mm) | 0.055" (1.40mm) | Gold | Flash | Solder | |||
|
|
TE Connectivity AMP Connectors |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 19914 EMBOSS ASSEM
|
- | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.078" (1.99mm) | 0.204" (5.17mm) | 0.079" (2.00mm) | Gold | Flash | Solder | |||
|
|
TE Connectivity AMP Connectors |
15,871
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 19914 EMBOSS ASSEM
|
- | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.078" (1.99mm) | 0.204" (5.17mm) | 0.079" (2.00mm) | Gold | Flash | Solder | |||
|
|
|
Laird Technologies EMI |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.315" (8.00mm) | 0.315" (8.00mm) | 0.315" (8.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
1,231
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.315" (8.00mm) | 0.315" (8.00mm) | 0.315" (8.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
1,231
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.315" (8.00mm) | 0.315" (8.00mm) | 0.315" (8.00mm) | - | - | Solder | ||
|
|
Leader Tech Inc. |
78
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 16.000" (406.40mm) | 0.550" (13.97mm) | Tin | - | Adhesive | |||
|
|
|
Laird Technologies EMI |
200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.591" (15.00mm) | 0.394" (10.00mm) | 0.394" (10.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
261
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.591" (15.00mm) | 0.394" (10.00mm) | 0.394" (10.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
261
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.591" (15.00mm) | 0.394" (10.00mm) | 0.394" (10.00mm) | - | - | Solder | ||
|
|
Laird Technologies EMI |
53
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
.140X.370 GASKET FABRIC O/ FOAM
|
121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | |||
|
|
Leader Tech Inc. |
93
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | - | |||
|
|
Leader Tech Inc. |
79
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | |||
|
|
Leader Tech Inc. |
67
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | Fingerstock | Beryllium Copper | - | - | 12.000" (304.80mm) | 0.310" (7.87mm) | - | - | - | |||
|
|
Leader Tech Inc. |
97
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.180" (4.57mm) | Tin | - | Adhesive | |||
|
|
Leader Tech Inc. |
99
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | - | - | |||
|
|
Leader Tech Inc. |
53
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 16.000" (406.40mm) | 0.550" (13.97mm) | - | - | Adhesive | |||
|
|
Leader Tech Inc. |
99
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | Fingerstock | Beryllium Copper | - | - | 12.000" (304.80mm) | 0.310" (7.87mm) | Tin | - | - | |||
|
|
Leader Tech Inc. |
4
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
NI/C FILLED SILICONE; 0.04" DIA.
|
-55°C ~ 160°C | Shielding Material | Conductive Elastomer | Round | - | 25.000 (7.62m) | 0.040" (1.02mm) | - | - | - | |||
|
|
Leader Tech Inc. |
2
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
NI/C FILLED SILICONE; 0.062" DIA
|
-55°C ~ 160°C | Shielding Material | Conductive Elastomer | Round | - | 25.000 (7.62m) | 0.062" (1.57mm) | - | - | - |
