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Discover 1,795 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IO NICU MESHG PU V0 REC
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- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR,STR,SU
|
- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,BF,USF,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.310" (7.87mm) | 24.000" (609.60mm) | 0.670" (17.02mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,BF,USF,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | - | - | Adhesive | ||||
Leader Tech Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 SN 14.01--11-S-32AF-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 14.010" (355.85mm) | 0.320" (8.13mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 BD 16--11-S-28RH-BD-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 BD 16--11-S-32AF-BD-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.13 X 0.37 BD 16--13-37RH-BD-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Unplated | - | Adhesive | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRS PU V0 CST
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- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR,STR,SNB
|
- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR,MRG,BF
|
- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL SNB PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRS PU V0 DSH
|
- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,BF,USFT,CLO
|
- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR,STR,SNB,USFT
|
- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
LS,STR,SNB,USFT,CLO
|
- | - | - | - | - | - | - | - | - | - | ||||
Leader Tech Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.13 X 0.37 BD 16--13-S-37RH-BD-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Unplated | - | Adhesive | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR,STR,BF
|
- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR,STR,SNB,USFT
|
- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR,STR,SNSAT
|
- | - | - | - | - | - | - | - | - | - |