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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Inquiry
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MOQ: 1 MPQ: 1
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AP,STR,SNB,PSA
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- | 121°C | Fingerstock | Beryllium Copper | 0.310" (7.87mm) | 24.000" (609.60mm) | 0.670" (17.02mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Inquiry
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-
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MOQ: 1 MPQ: 1
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CLO,STR,NID
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- | 121°C | Fingerstock | Beryllium Copper | 0.280" (7.11mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | Nickel | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
Inquiry
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-
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MOQ: 1 MPQ: 1
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CLO,STR,ZNY
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- | 121°C | Fingerstock | Beryllium Copper | 0.280" (7.11mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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CLO,STR,SNB
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- | 121°C | Fingerstock | Beryllium Copper | 0.280" (7.11mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | Tin | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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CLO,STR,DLN,SNSAT
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- | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.210" (5.33mm) | Tin | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
Inquiry
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-
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MOQ: 1 MPQ: 1
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DINC,BF
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- | - | - | - | - | - | - | - | - | - | ||
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Laird Technologies EMI |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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FOS,SNB
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- | - | - | - | - | - | - | - | - | - | ||
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Laird Technologies EMI |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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USBC,SNB
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- | - | - | - | - | - | - | - | - | - | ||
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Laird Technologies EMI |
Inquiry
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-
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MOQ: 1 MPQ: 1
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DCON,15P,ZNY
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- | 121°C | Fingerstock | Beryllium Copper | 0.025" (0.64mm) | 1.740" (44.20mm) | 0.690" (17.53mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Slot | ||
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Laird Technologies EMI |
Inquiry
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-
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MOQ: 1 MPQ: 1
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DCON,25P,SNB
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- | 121°C | Fingerstock | Beryllium Copper | 0.025" (0.64mm) | 2.280" (57.91mm) | 0.690" (17.53mm) | Tin | 299.21μin (7.60μm) | Slot | ||
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Laird Technologies EMI |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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DCON,15P,SNB
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- | 121°C | Fingerstock | Beryllium Copper | 0.025" (0.64mm) | 1.740" (44.20mm) | 0.690" (17.53mm) | Tin | 299.21μin (7.60μm) | Slot | ||
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Laird Technologies EMI |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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STS3,STR,BF
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- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
Inquiry
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-
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MOQ: 1 MPQ: 1
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GK NICU PTAFG PU V0 REC
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- | - | - | - | - | - | - | - | - | - | ||
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Laird Technologies EMI |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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AP,STR,SU,PSA
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- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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CLO,STR,SNB
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- | 121°C | Fingerstock | Beryllium Copper | 0.400" (10.16mm) | 24.000" (609.60mm) | 0.980" (24.89mm) | Tin | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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IO NICU PTAFG PU V0 REC
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- | - | - | - | - | - | - | - | - | - | ||
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Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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AP,STR,BF
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- | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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GK NICU PTAFG PU V0 REC
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- | - | - | - | - | - | - | - | - | - | ||
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Laird Technologies EMI |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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PCBS COIL BF
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- | - | - | - | - | 25.000 (7.62m) | 0.520" (13.20mm) | - | - | - | ||
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Laird Technologies EMI |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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TWT,STR,SNSAT,PSA,POR
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- | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21μin (7.60μm) | Adhesive |
