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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Inquiry
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-
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MOQ: 1 MPQ: 1
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TWT,STR,ZNC,USFT,PSA
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Twist | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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LS,STR,BF
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- | 121°C | Fingerstock | Beryllium Copper | 0.300" (7.62mm) | 18.750" (476.25mm) | 0.800" (20.32mm) | - | - | Hardware | ||
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Laird Technologies EMI |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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TWT,STR,SNB,PSA
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Twist | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.500" (12.70mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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S3,STR,BF,RIV
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- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | - | - | Rivet | ||
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Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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NOSG,STR,ZNC,PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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AP,STR,SNSAT,RA
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- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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VSLMT,STR,ZNC,CTL
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- | - | - | - | - | - | - | - | - | - | ||
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Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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AP,STR,ZNC,RA
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- | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,BF,USFT
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.200" (5.08mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,NID,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,ZNC,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,ZNY,PSA
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- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,NIE,PSA
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- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,NIB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,SNSAT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21μin (7.60μm) | Adhesive |
