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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,NIB,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNSAT,RA,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.160" (4.06mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,ZNC,RA,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.160" (4.06mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,17S,NIB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.160" (4.06mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
LS,STR,SNB,CLO
|
- | 121°C | Fingerstock | Beryllium Copper | 0.176" (4.47mm) | 17.000" (433.22mm) | 0.295" (7.49mm) | Tin | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
DES,STR,SNB,CLO
|
- | - | - | - | - | 12.000" (304.80mm) | 0.062" (1.59mm) | - | - | - | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
DES,STR,NIE,CLO
|
- | - | - | - | - | 12.000" (304.80mm) | 0.062" (1.59mm) | - | - | - | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
DES,STR,NIB,CLO
|
- | - | - | - | - | 12.000" (304.80mm) | 0.062" (1.59mm) | - | - | - | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR,STR,BF
|
- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,BF
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,BF,USF,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.200" (5.08mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,BF,USF,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR,STR,NID
|
- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
DES,STR,SNB,CLO
|
- | - | - | - | - | 12.000" (304.80mm) | 0.183" (4.65mm) | - | - | - | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR,STR,SNB
|
- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,SNB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,BF
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.500" (12.70mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,USF,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Tin | 299.21μin (7.60μm) | Adhesive |