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Discover 266 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | USB | Security Features | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | USB | Security Features | |
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NXP USA Inc. |
Inquiry
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MOQ: 2 MPQ: 1
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IC MPU MPC82XX 300MHZ 480TBGA
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MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 300MHz | Communications; RISC CPM | DRAM，SDRAM | - | - | - | ||
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NXP USA Inc. |
Inquiry
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MOQ: 2 MPQ: 1
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IC MPU MPC82XX 200MHZ 480TBGA
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MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 200MHz | Communications; RISC CPM | DRAM，SDRAM | - | - | - | ||
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NXP USA Inc. |
Inquiry
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MOQ: 2 MPQ: 1
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IC MPU MPC82XX 300MHZ 480TBGA
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MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 300MHz | Communications; RISC CPM | DRAM，SDRAM | - | - | - | ||
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NXP USA Inc. |
Inquiry
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MOQ: 2 MPQ: 1
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IC MPU MPC82XX 300MHZ 480TBGA
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MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 300MHz | Communications; RISC CPM | DRAM，SDRAM | - | - | - | ||
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NXP USA Inc. |
Inquiry
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MOQ: 2 MPQ: 1
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IC MPU MPC82XX 300MHZ 480TBGA
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MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 300MHz | Communications; RISC CPM | DRAM，SDRAM | - | - | - | ||
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NXP USA Inc. |
Inquiry
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MOQ: 2 MPQ: 1
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IC MPU MPC82XX 266MHZ 516BGA
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MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | Communications; RISC CPM | DRAM，SDRAM | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
Inquiry
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MOQ: 2 MPQ: 1
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IC MPU MPC82XX 333MHZ 480TBGA
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MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 333MHz | Communications; RISC CPM | DRAM，SDRAM | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
Inquiry
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MOQ: 2 MPQ: 1
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IC MPU MPC82XX 450MHZ 480TBGA
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MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 450MHz | Communications; RISC CPM | DRAM，SDRAM | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
Inquiry
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MOQ: 2 MPQ: 1
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IC MPU MPC82XX 266MHZ 516BGA
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MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | Communications; RISC CPM | DRAM，SDRAM | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
Inquiry
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-
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MOQ: 2 MPQ: 1
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IC MPU MPC82XX 333MHZ 480TBGA
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MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 333MHz | Communications; RISC CPM | DRAM，SDRAM | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
Inquiry
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-
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MOQ: 2 MPQ: 1
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IC MPU MPC82XX 450MHZ 480TBGA
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MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 450MHz | Communications; RISC CPM | DRAM，SDRAM | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2 MPQ: 1
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IC MPU MPC82XX 266MHZ 516BGA
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MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | Communications; RISC CPM | DRAM，SDRAM | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2 MPQ: 1
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IC MPU MPC82XX 450MHZ 480TBGA
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MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 450MHz | Communications; RISC CPM | DRAM，SDRAM | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 2 MPQ: 1
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IC MPU MPC82XX 266MHZ 516BGA
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MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | Communications; RISC CPM | DRAM，SDRAM | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
Inquiry
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-
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MOQ: 2 MPQ: 1
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IC MPU MPC82XX 450MHZ 480TBGA
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MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 450MHz | Communications; RISC CPM | DRAM，SDRAM | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2 MPQ: 1
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IC MPU MPC82XX 266MHZ 516BGA
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MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | Communications; RISC CPM | DRAM，SDRAM | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2 MPQ: 1
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IC MPU MPC82XX 266MHZ 516BGA
|
MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | Communications; RISC CPM | DRAM，SDRAM | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | Communications; RISC CPM | DRAM，SDRAM | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2 MPQ: 1
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IC MPU MPC82XX 266MHZ 516BGA
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MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | Communications; RISC CPM | DRAM，SDRAM | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2 MPQ: 1
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IC MPU MPC82XX 333MHZ 480TBGA
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MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 333MHz | Communications; RISC CPM | DRAM，SDRAM | - | USB 2.0 (1) | - |
