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Discover 4,746 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
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NXP USA Inc. |
112
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC8XX 133MHZ 357BGA
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Tray | MPC8xx | 0°C ~ 95°C (TA) | 357-BBGA | 357-PBGA (25x25) | MPC8xx | 3.3V | 133MHz | 1 Core，32-Bit | Communications; CPM，Security; SEC | DRAM | - | 10 Mbps (3)，10/100 Mbps (2) | - | USB 2.0 (1) | Cryptography | ||
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NXP USA Inc. |
120
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU M683XX 33MHZ 144LQFP
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Tray | M683xx | 0°C ~ 70°C (TA) | 144-LQFP | 144-LQFP (20x20) | M68000 | 5.0V | 33MHz | 1 Core，8/16-Bit | Communications; RISC CPM | DRAM | - | - | - | - | - | ||
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NXP USA Inc. |
221
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU M683XX 25MHZ 132QFP
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Tray | M683xx | 0°C ~ 70°C (TA) | 132-BQFP Bumpered | 132-PQFP (24.13x24.13) | M68000 | 5.0V | 25MHz | 1 Core，8/16-Bit | Communications; RISC CPM | DRAM | - | - | - | - | - | ||
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NXP USA Inc. |
122
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC83XX 400MHZ 620BGA
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Tray | MPC83XX | 0°C ~ 105°C (TA) | 620-BBGA Exposed Pad | 620-PBGA (29x29) | PowerPC e300 | 2.5V，3.3V | 400MHz | 1 Core，32-Bit | - | DDR | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | - | ||
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NXP USA Inc. |
135
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC83XX 667MHZ 689TEBGA
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Tray | MPC83XX | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | PowerPC e300c4s | 1.8V，2.5V，3.3V | 667MHz | 1 Core，32-Bit | Security; SEC 3.0 | DDR，DDR2 | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | Cryptography，Random Number Generator | ||
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NXP USA Inc. |
150
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU Q OR IQ 800MHZ 689TEBGA
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Tray | QorIQ P1 | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | PowerPC e500v2 | 2.5V，3.3V | 800MHz | 2 Core，32-Bit | Security; SEC 3.3 | DDR2，DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | Cryptography，Random Number Generator | ||
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NXP USA Inc. |
139
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC82XX 333MHZ 352TBGA
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Tray | MPC82xx | 0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 3.3V | 333MHz | 1 Core，32-Bit | - | SDRAM | - | - | - | - | - | ||
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NXP USA Inc. |
32
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU Q OR IQ 1.055GHZ 689TBGA
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Tray | QorIQ P1 | 0°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | PowerPC e500v2 | - | 1.055GHz | 2 Core，32-Bit | - | DDR2，DDR3 | LCD | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | ||
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NXP USA Inc. |
40
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC82XX 266MHZ 516BGA
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Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
29
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC82XX 333MHZ 480TBGA
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Tray | MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 333MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
27
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU Q OR IQ 1.2GHZ 689TEBGA
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Tray | QorIQ P2 | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | PowerPC e500v2 | - | 1.2GHz | 1 Core，32-Bit | - | DDR2，DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | ||
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NXP USA Inc. |
42
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MPU MPC83XX 667MHZ 672TBGA
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Tray | MPC83XX | 0°C ~ 105°C (TA) | 672-LBGA | 672-TBGA (35x35) | PowerPC e300 | 2.5V，3.3V | 667MHz | 1 Core，32-Bit | Security; SEC | DDR | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | Cryptography，Random Number Generator | ||
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NXP USA Inc. |
55
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC85XX 833MHZ 783FCBGA
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Tray | MPC85xx | 0°C ~ 105°C (TA) | 783-BBGA，FCBGA | 783-FCPBGA (29x29) | PowerPC e500 | 2.5V，3.3V | 833MHz | 1 Core，32-Bit | - | DDR，SDRAM | - | 10/100/1000 Mbps (2) | - | - | - | ||
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Microchip Technology |
1,769
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 128KB ROM 217BGA
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Cut Tape (CT) | SAM9N | -40°C ~ 85°C (TA) | 217-LFBGA | 217-LFBGA (15x15) | ARM926EJ-S | 1.8V，3.3V | 400MHz | 1 Core，32-Bit | - | LPDDR，LPDDR2，DDR2，SDR，SRAM | LCD，Touchscreen | - | - | USB 2.0 (2) | - | ||
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NXP USA Inc. |
299
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX6ULZ 900MHZ 196MAPBGA
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Tray | i.MX6 | 0°C ~ 95°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | - | 900MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3，DDR3L | Keypad | - | - | USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CSU，SJC，SNVS | ||
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NXP USA Inc. |
1,022
|
3 days |
-
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MOQ: 1 MPQ: 1
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I.MXRT1020 100LQFP
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Tray | - | 0°C ~ 95°C (TJ) | 100-LQFP | 100-LQFP (14x14) | ARM® Cortex®-M7 | 1.8V，3.3V | 500MHz | 1 Core，32-Bit | - | SDRAM | - | 10/100 Mbps (1) | - | USB 2.0 OTG + PHY (1) | Ciphers，eFuse，RNG，Secure RTC | ||
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NXP USA Inc. |
1,053
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
I.MXRT1020 100LQFP
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Tray | - | -40°C ~ 105°C (TJ) | 100-LQFP | 100-LQFP (14x14) | ARM® Cortex®-M7 | 1.8V，3.3V | 396MHz | 1 Core，32-Bit | - | SDRAM | - | 10/100 Mbps (1) | - | USB 2.0 OTG + PHY (1) | Ciphers，eFuse，RNG，Secure RTC | ||
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|
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NXP USA Inc. |
1,000
|
3 days |
-
|
MOQ: 1000 MPQ: 1
|
IC MPU I.MX28 454MHZ 289MAPBGA
|
Tape & Reel (TR) | i.MX28 | -40°C ~ 85°C (TA) | 289-LFBGA | 289-MAPBGA (14x14) | ARM926EJ-S | 1.8V，3.3V | 454MHz | 1 Core，32-Bit | Data; DCP | LVDDR，LVDDR2，DDR2 | Keypad，LCD，Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + PHY (2) | Boot Security，Cryptography，Hardware ID | ||
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|
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NXP USA Inc. |
223
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
I.MX 32-BIT MPU ARM CORTEX-A7 C
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Tray | i.MX6 | 0°C ~ 95°C (TJ) | 272-LFBGA | 272-MAPBGA (9x9) | ARM® Cortex®-A7 | 1.8V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DDR3L | Electrophoretic，LCD | 10/100 Mbps (2) | - | USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CSU，SJC，SNVS | ||
|
|
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NXP USA Inc. |
241
|
3 days |
-
|
MOQ: 1 MPQ: 1
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528MHZETHERNET X1 USB OTG X1
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Tray | i.MX6 | 0°C ~ 95°C (TJ) | 272-LFBGA | 272-MAPBGA (9x9) | ARM® Cortex®-A7 | 1.8V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DDR3L | Electrophoretic，LCD | 10/100 Mbps (1) | - | USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CSU，SJC，SNVS |
