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Discover 4,746 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
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Microchip Technology |
500
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 64KB ROM 217BGA
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- | SAM9G | -40°C ~ 85°C (TA) | 217-LFBGA | 217-LFBGA (15x15) | ARM926EJ-S | 1.8V，3.3V | 400MHz | 1 Core，32-Bit | - | DDR2，SDRAM，SRAM | LCD，Touchscreen | 10/100 Mbps | - | USB 2.0 (3) | - | ||
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Microchip Technology |
1,000
|
3 days |
-
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MOQ: 1000 MPQ: 1
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IC MCU 32BIT 160KB ROM 324TFBGA
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Tape & Reel (TR) | SAMA5D3 | -40°C ~ 85°C (TA) | 324-TFBGA | 324-TFBGA (12x12) | ARM® Cortex®-A5 | 1.2V，1.8V，3.3V | 536MHz | 1 Core，32-Bit | - | LPDDR，LPDDR2，DDR2 | LCD，Touchscreen | 10/100 Mbps (1) | - | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
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Microchip Technology |
1,000
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 160KB ROM 324TFBGA
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Cut Tape (CT) | SAMA5D3 | -40°C ~ 85°C (TA) | 324-TFBGA | 324-TFBGA (12x12) | ARM® Cortex®-A5 | 1.2V，1.8V，3.3V | 536MHz | 1 Core，32-Bit | - | LPDDR，LPDDR2，DDR2 | LCD，Touchscreen | 10/100 Mbps (1) | - | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
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Microchip Technology |
1,000
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 160KB ROM 324TFBGA
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- | SAMA5D3 | -40°C ~ 85°C (TA) | 324-TFBGA | 324-TFBGA (12x12) | ARM® Cortex®-A5 | 1.2V，1.8V，3.3V | 536MHz | 1 Core，32-Bit | - | LPDDR，LPDDR2，DDR2 | LCD，Touchscreen | 10/100 Mbps (1) | - | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
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NXP USA Inc. |
1,042
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX28 454MHZ 289MAPBGA
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Tray | i.MX28 | -20°C ~ 70°C (TA) | 289-LFBGA | 289-MAPBGA (14x14) | ARM926EJ-S | 1.8V，3.3V | 454MHz | 1 Core，32-Bit | Data; DCP | LVDDR，LVDDR2，DDR2 | Keypad | 10/100 Mbps (1) | - | USB 2.0 + PHY (2) | Boot Security，Cryptography，Hardware ID | ||
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Zilog |
113
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU Z180 20MHZ 68PLCC
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Tube | Z180 | 0°C ~ 70°C (TA) | 68-LCC (J-Lead) | 68-PLCC | Z8S180 | 5.0V | 20MHz | 1 Core，8-Bit | - | DRAM | - | - | - | - | - | ||
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NXP USA Inc. |
673
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX23 454MHZ 128LQFP
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Tray | i.MX23 | -40°C ~ 85°C (TA) | 128-LQFP | 128-LQFP (14x14) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V，3.3V | 454MHz | 1 Core，32-Bit | Data; DCP | DRAM | LCD，Touchscreen | - | - | USB 2.0 + PHY (1) | Cryptography，Hardware ID | ||
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NXP USA Inc. |
880
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX23 454MHZ 169MAPBGA
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Tray | i.MX23 | -10°C ~ 70°C (TA) | 169-LFBGA | 169-MAPBGA (11x11) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V，3.3V | 454MHz | 1 Core，32-Bit | Data; DCP | DRAM | LCD，Touchscreen | - | - | USB 2.0 + PHY (1) | Cryptography，Hardware ID | ||
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NXP USA Inc. |
1,520
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX28 454MHZ 289MAPBGA
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Tray | i.MX28 | -20°C ~ 70°C (TA) | 289-LFBGA | 289-MAPBGA (14x14) | ARM926EJ-S | 1.8V，3.3V | 454MHz | 1 Core，32-Bit | Data; DCP | LVDDR，LVDDR2，DDR2 | Keyboard，LCD，Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + PHY (2) | Boot Security，Cryptography，Hardware ID | ||
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Texas Instruments |
134
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU SITARA 375MHZ 176HLQFP
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Tube | Sitara | 0°C ~ 90°C (TJ) | 176-LQFP Exposed Pad | 176-HLQFP (24x24) | ARM926EJ-S | 1.8V，3.3V | 375MHz | 1 Core，32-Bit | System Control; CP15 | SDRAM | - | 10/100 Mbps (1) | - | USB 2.0 + PHY (1) | - | ||
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NXP USA Inc. |
1,252
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX25 400MHZ 400MAPBGA
|
Tray | i.MX25 | -20°C ~ 70°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V，3.3V | 400MHz | 1 Core，32-Bit | - | LPDDR，DDR，DDR2 | Keypad，LCD，Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + PHY (2) | - | ||
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NXP USA Inc. |
545
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX28 454MHZ 289MAPBGA
|
Tray | i.MX28 | -40°C ~ 85°C (TA) | 289-LFBGA | 289-MAPBGA (14x14) | ARM926EJ-S | 1.8V，3.3V | 454MHz | 1 Core，32-Bit | Data; DCP | LVDDR，LVDDR2，DDR2 | Keyboard，LCD，Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + PHY (2) | Boot Security，Cryptography，Hardware ID | ||
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NXP USA Inc. |
139
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC83XX 266MHZ 369BGA
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Tray | MPC83XX | 0°C ~ 105°C (TA) | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 266MHz | 1 Core，32-Bit | Communications; QUICC Engine | DDR2 | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
2,324
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 369BGA
|
Tray | MPC83XX | -40°C ~ 105°C (TA) | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 266MHz | 1 Core，32-Bit | Communications; QUICC Engine | DDR2 | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
361
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 50MHZ 256BGA
|
Tray | MPC8xx | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 3.3V | 50MHz | 1 Core，32-Bit | Communications; CPM | DRAM | - | 10 Mbps (1) | - | - | - | ||
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|
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NXP USA Inc. |
120
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
Tray | i.MX6SX | -40°C ~ 125°C (TJ) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LVDDR3，DDR3 | Keypad，LCD | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
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|
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NXP USA Inc. |
1,822
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 66MHZ 256BGA
|
Tray | MPC8xx | -40°C ~ 100°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 3.3V | 66MHz | 1 Core，32-Bit | Communications; CPM | DRAM | - | 10 Mbps (1) | - | - | - | ||
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|
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NXP USA Inc. |
137
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU M683XX 16MHZ 100LQFP
|
Tray | M683xx | 0°C ~ 70°C (TA) | 100-LQFP | 100-LQFP (14x14) | M68000 | 5.0V | 16MHz | 1 Core，8/16-Bit | Communications; RISC CPM | DRAM | - | - | - | - | - | ||
|
|
|
NXP USA Inc. |
1,080
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 256BGA
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Tray | MPC8xx | -40°C ~ 100°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 3.3V | 133MHz | 1 Core，32-Bit | Communications; CPM | DRAM | - | 10/100 Mbps (2) | - | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
131
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MPU MPC83XX 400MHZ 620BGA
|
Tray | MPC83XX | 0°C ~ 105°C (TA) | 620-BBGA Exposed Pad | 620-PBGA (29x29) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 400MHz | 1 Core，32-Bit | Security; SEC 3.3 | DDR，DDR2 | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | Cryptography，Random Number Generator |
