- Operating Temperature：
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- Supplier Device Package：
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- Core Processor：
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- Speed：
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- Voltage - Supply (Vcc/Vdd)：
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Discover 119 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | |
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Microchip Technology |
1,006
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 64TQFP
|
Tray | AVR32 UC3 C | -40°C ~ 85°C (TA) | 64-TQFP Exposed Pad | 64-TQFP (10x10) | AVR | 45 | 66MHz | 64K x 8 | 512KB (512K x 8) | 3 V ~ 5.5 V | A/D 11x12b，D/A 2x12b | |||
|
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Microchip Technology |
2,939
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 100TQFP
|
Tray | AVR32 UC3 C | -40°C ~ 85°C (TA) | 100-TQFP | 100-TQFP (14x14) | AVR | 81 | 66MHz | 64K x 8 | 512KB (512K x 8) | 3 V ~ 5.5 V | A/D 16x12b，D/A 4x12b | |||
|
|
Microchip Technology |
132
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64TQFP
|
Tray | AVR32 UC3 C | -40°C ~ 85°C (TA) | 64-TQFP Exposed Pad | 64-TQFP (10x10) | AVR | 45 | 66MHz | 32K x 8 | 128KB (128K x 8) | 3 V ~ 5.5 V | A/D 11x12b，D/A 2x12b | |||
|
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Microchip Technology |
585
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 100TQFP
|
Tray | AVR32 UC3 C | -40°C ~ 85°C (TA) | 100-TQFP | 100-TQFP (14x14) | AVR | 81 | 66MHz | 32K x 8 | 128KB (128K x 8) | 3 V ~ 5.5 V | A/D 16x12b，D/A 4x12b | |||
|
|
Microchip Technology |
243
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 64QFN
|
Tray | AVR32 UC3 C | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | AVR | 45 | 66MHz | 64K x 8 | 512KB (512K x 8) | 3 V ~ 5.5 V | A/D 11x12b，D/A 2x12b | |||
|
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Microchip Technology |
944
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 100TQFP
|
Tray | AVR32 UC3 C | -40°C ~ 85°C (TA) | 100-TQFP | 100-TQFP (14x14) | AVR | 81 | 66MHz | 64K x 8 | 256KB (256K x 8) | 3 V ~ 5.5 V | A/D 16x12b，D/A 4x12b | |||
|
|
Microchip Technology |
187
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 100TQFP
|
Tray | AVR32 UC3 C | -40°C ~ 85°C (TA) | 100-TQFP | 100-TQFP (14x14) | AVR | 81 | 66MHz | 16K x 8 | 64KB (64K x 8) | 3 V ~ 5.5 V | A/D 16x12b，D/A 4x12b | |||
|
|
Microchip Technology |
1,000
|
3 days |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 100TQFP
|
Tape & Reel (TR) | AVR32 UC3 C | -40°C ~ 85°C (TA) | 100-TQFP | 100-TQFP (14x14) | AVR | 81 | 66MHz | 16K x 8 | 64KB (64K x 8) | 3 V ~ 5.5 V | A/D 16x12b，D/A 4x12b | |||
|
|
Microchip Technology |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 100TQFP
|
Cut Tape (CT) | AVR32 UC3 C | -40°C ~ 85°C (TA) | 100-TQFP | 100-TQFP (14x14) | AVR | 81 | 66MHz | 16K x 8 | 64KB (64K x 8) | 3 V ~ 5.5 V | A/D 16x12b，D/A 4x12b | |||
|
|
Microchip Technology |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 100TQFP
|
- | AVR32 UC3 C | -40°C ~ 85°C (TA) | 100-TQFP | 100-TQFP (14x14) | AVR | 81 | 66MHz | 16K x 8 | 64KB (64K x 8) | 3 V ~ 5.5 V | A/D 16x12b，D/A 4x12b | |||
|
|
Microchip Technology |
2,000
|
3 days |
-
|
MOQ: 2000 MPQ: 1
|
CM7,512KB FLASH,256KB SRAM
|
Tape & Reel (TR) | SAM E70 | -40°C ~ 105°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | ARM Cortex-M7 | 75 | 300MHz | 256K x 8 | 512KB (512K x 8) | 1.62 V ~ 3.6 V | A/D 10x12b; D/A 2x12b | |||
|
|
Microchip Technology |
2,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CM7,512KB FLASH,256KB SRAM
|
Cut Tape (CT) | SAM E70 | -40°C ~ 105°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | ARM Cortex-M7 | 75 | 300MHz | 256K x 8 | 512KB (512K x 8) | 1.62 V ~ 3.6 V | A/D 10x12b; D/A 2x12b | |||
|
|
Microchip Technology |
2,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CM7,512KB FLASH,256KB SRAM
|
- | SAM E70 | -40°C ~ 105°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | ARM Cortex-M7 | 75 | 300MHz | 256K x 8 | 512KB (512K x 8) | 1.62 V ~ 3.6 V | A/D 10x12b; D/A 2x12b | |||
|
|
Microchip Technology |
228
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 64LQFP
|
Tray | SAM E70 | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | ARM Cortex-M7 | 44 | 300MHz | 256K x 8 | 512KB (512K x 8) | 1.62 V ~ 3.6 V | A/D 5x12b，D/A 1x12b | |||
|
|
Microchip Technology |
637
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CM7,1024KB FLASH,384KB SRAM,LQFP
|
Tray | SAM E70 | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | ARM Cortex-M7 | 44 | 300MHz | 384K x 8 | 1MB (1M x 8) | 1.7 V ~ 3.6 V | A/D 5x12b，D/A 1x12b | |||
|
|
Microchip Technology |
146
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 64LQFP
|
Tray | SAM E70 | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | ARM Cortex-M7 | 44 | 300MHz | 384K x 8 | 1MB (1M x 8) | 1.62 V ~ 3.6 V | A/D 5x12b，D/A 1x12b | |||
|
|
Microchip Technology |
780
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CM7,512KB FLASH,256KB SRAM,BGA10
|
Tray | SAM E70 | -40°C ~ 105°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | ARM Cortex-M7 | 75 | 300MHz | 384K x 8 | 512KB (512K x 8) | 1.7 V ~ 3.6 V | A/D 10x12b，D/A 2x12b | |||
|
|
Microchip Technology |
535
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
CM7,1024KB FLASH,384KB SRAM,LQFP
|
Tray | SAM E70 | -40°C ~ 105°C (TA) | 100-LQFP | 100-LQFP (14x14) | ARM Cortex-M7 | 75 | 300MHz | 384K x 8 | 1MB (1M x 8) | 1.7 V ~ 3.6 V | A/D 10x12b，D/A 2x12b | |||
|
|
Microchip Technology |
980
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 144FBGA
|
Tray | SAM S70 | -40°C ~ 105°C (TA) | 144-LFBGA | 144-LFBGA (10x10) | ARM Cortex-M7 | 75 | 300MHz | 384K x 8 | 1MB (1M x 8) | 1.62 V ~ 3.6 V | A/D 10x12b; D/A 2x12b | |||
|
|
Microchip Technology |
5,000
|
3 days |
-
|
MOQ: 5000 MPQ: 1
|
IC MCU 32BIT 2MB FLASH 144FBGA
|
Tape & Reel (TR) | SAM S70 | -40°C ~ 105°C (TA) | 144-LFBGA | 144-LFBGA (10x10) | ARM Cortex-M7 | 75 | 300MHz | 384K x 8 | 2MB (2M x 8) | 1.62 V ~ 3.6 V | A/D 10x12b; D/A 2x12b |
