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Discover 12,628 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
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Maxim Integrated |
376
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT ROMLESS 44PLCC
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Tube | 80C | 0°C ~ 70°C (TA) | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) | Power-Fail Reset，WDT | 8051 | 32 | 33MHz | 256 x 8 | - | ROMless | - | 4.5 V ~ 5.5 V | - | EBI/EMI，SIO，UART/USART | 8-Bit | ||
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Renesas Electronics America |
245
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 256KB FLASH 80LQFP
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Tray | SuperH SH7136 | -40°C ~ 85°C (TA) | 80-LQFP | 80-LQFP (14x14) | POR，PWM，WDT | SH-2 | 44 | 80MHz | 16K x 8 | 256KB (256K x 8) | Flash | - | 3 V ~ 5.5 V | A/D 12x12b | CANbus，EBI/EMI，I2C，SCI，SSU | 32-Bit | ||
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NXP USA Inc. |
2,570
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 128KB FLASH 128LQFP
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Tray | 56F8xxx | -40°C ~ 125°C (TA) | 128-LQFP | 128-LQFP (14x20) | POR，PWM，Temp Sensor，WDT | 56800E | 49 | 60MHz | 6K x 16 | 128KB (64K x 16) | Flash | - | 2.25 V ~ 3.6 V | A/D 16x12b | CANbus，EBI/EMI，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
1,355
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 16KB ROM 196MAPBGA
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Tray | MCF527x | 0°C ~ 70°C (TA) | 196-LBGA | 196-MAPBGA (15x15) | DMA，WDT | Coldfire V2 | 32 | 66MHz | 1K x 32 | 16KB (4K x 32) | ROM | - | 3 V ~ 3.6 V | - | EBI/EMI，Ethernet，I2C，SPI，UART/USART，USB | 32-Bit | ||
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NXP USA Inc. |
963
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 512KB FLASH 112LQFP
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Tray | HCS12X | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 91 | 80MHz | 32K x 8 | 512KB (512K x 8) | Flash | 4K x 8 | 2.35 V ~ 5.5 V | A/D 16x10b | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
2,280
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 512KB FLASH 144LQFP
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Tray | HCS12X | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 119 | 80MHz | 32K x 8 | 512KB (512K x 8) | Flash | 4K x 8 | 2.35 V ~ 5.5 V | A/D 24x10b | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit | ||
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Maxim Integrated |
170
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 64KB FLASH 44PLCC
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Tube | 89C | -40°C ~ 85°C (TA) | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) | Power-Fail Reset，WDT | 8051 | 32 | 33MHz | 1K x 8 | 64KB (64K x 8) | Flash | - | 4.5 V ~ 5.5 V | - | EBI/EMI，SIO，UART/USART | 8-Bit | ||
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NXP USA Inc. |
1,153
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 120KB FLASH 160LQFP
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Tray | 56F8xx | -40°C ~ 85°C (TA) | 160-LQFP | 160-LQFP (24x24) | POR，PWM，WDT | 56800 | 32 | 80MHz | 4K x 16 | 120KB (60K x 16) | Flash | - | 3 V ~ 3.6 V | A/D 16x12b | CANbus，EBI/EMI，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
1,307
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT ROMLESS 324TEPBGA
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Tray | MPC51xx | -40°C ~ 125°C (TJ) | 324-BBGA | 324-TEPBGA (23x23) | DMA，WDT | e300 | 64 | 400MHz | 32K x 8 | - | ROMless | - | 1.08 V ~ 3.6 V | - | CANbus，EBI/EMI，Ethernet，I2C，USB OTG | 32-Bit | ||
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NXP USA Inc. |
534
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 512KB FLASH 144LQFP
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Tray | HCS12X | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 119 | 80MHz | 32K x 8 | 512KB (512K x 8) | Flash | 4K x 8 | 2.35 V ~ 5.5 V | A/D 24x10b | CANbus，EBI/EMI，I2C，IrDA，LINbus，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
1,489
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 32KB FLASH 80QFP
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Tray | HC12 | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | POR，PWM，WDT | CPU12 | 63 | 8MHz | 1K x 8 | 32KB (32K x 8) | Flash | 768 x 8 | 4.5 V ~ 5.5 V | A/D 8x10b | SCI，SPI | 16-Bit | ||
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Maxim Integrated |
295
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT ROMLESS 44TQFP
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Tray | 80C | -40°C ~ 85°C (TA) | 44-TQFP | 44-TQFP (10x10) | Power-Fail Reset，WDT | 8051 | 32 | 33MHz | 256 x 8 | - | ROMless | - | 4.5 V ~ 5.5 V | - | EBI/EMI，SIO，UART/USART | 8-Bit | ||
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Maxim Integrated |
160
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT ROMLESS 64LQFP
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Tray | 80C | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | Power-Fail Reset，WDT | 8051 | 32 | 40MHz | 4K x 8 | - | ROMless | - | 3.85 V ~ 5.5 V | - | CANbus，EBI/EMI，SIO，UART/USART | 8-Bit | ||
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NXP USA Inc. |
2,432
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144LQFP
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Tray | 56F8xxx | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | POR，PWM，Temp Sensor，WDT | 56800E | 62 | 60MHz | 18K x 16 | 512KB (256K x 16) | Flash | - | 2.25 V ~ 3.6 V | A/D 16x12b | CANbus，EBI/EMI，SCI，SPI | 16-Bit | ||
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Renesas Electronics America |
140
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 144TQFP
|
Tray | H8 H8S/2100 | -20°C ~ 75°C (TA) | 144-TQFP | 144-TQFP (16x16) | POR，PWM，WDT | H8S/2000 | 106 | 33MHz | 40K x 8 | 512KB (512K x 8) | Flash | - | 3 V ~ 3.6 V | A/D 8x10b; D/A 2x8b | I2C，IrDA，LPC，SCI，SmartCard | 16-Bit | ||
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NXP USA Inc. |
1,007
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 160LQFP
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Tray | 56F8xxx | -40°C ~ 105°C (TA) | 160-LQFP | 160-LQFP (24x24) | POR，PWM，Temp Sensor，WDT | 56800E | 76 | 60MHz | 18K x 16 | 512KB (256K x 16) | Flash | - | 2.25 V ~ 3.6 V | A/D 16x12b | CANbus，EBI/EMI，SCI，SPI | 16-Bit | ||
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|
|
Renesas Electronics America |
170
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 176LFQFP
|
Tray | SuperH SH7216 | -40°C ~ 85°C (TA) | 176-LQFP | 176-LFQFP (24x24) | DMA，PWM，WDT | SH2A-FPU | 112 | 200MHz | 128K x 8 | 1MB (1M x 8) | Flash | - | 3 V ~ 3.6 V | A/D 8x12b | CANbus，Ethernet，I2C，SCI，SPI，USB | 32-Bit | ||
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|
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Maxim Integrated |
520
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT ROMLESS 68PLCC
|
Tube | 80C | -40°C ~ 85°C (TA) | 68-LCC (J-Lead) | 68-PLCC (24.23x24.23) | Power-Fail Reset，WDT | 8051 | 32 | 40MHz | 4K x 8 | - | ROMless | - | 3.85 V ~ 5.5 V | - | CANbus，EBI/EMI，SIO，UART/USART | 8-Bit | ||
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|
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NXP USA Inc. |
3,946
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 256BGA
|
Tray | MCF528x | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA，LVD，POR，PWM，WDT | Coldfire V2 | 150 | 66MHz | 64K x 8 | 512KB (512K x 8) | Flash | - | 2.7 V ~ 3.6 V | A/D 8x10b | CANbus，EBI/EMI，Ethernet，I2C，SPI，UART/USART | 32-Bit | ||
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|
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NXP USA Inc. |
101
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 256MAPBGA
|
Tray | MCF523x | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA，WDT | Coldfire V2 | 97 | 150MHz | 64K x 8 | - | ROMless | - | 1.4 V ~ 1.6 V | - | CANbus，EBI/EMI，Ethernet，I2C，SPI，UART/USART | 32-Bit |
