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Discover 12,628 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | |
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Texas Instruments |
798
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 768KB FLASH 100LQFP
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Tray | Hercules RM4 ARM Cortex-R4 | -40°C ~ 105°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA，POR，PWM，WDT | ARM Cortex-R4F | 45 | 120MHz | 128K x 8 | 768KB (768K x 8) | Flash | 64K x 8 | 1.14 V ~ 3.6 V | A/D 16x12b | CANbus，LINbus，MibSPI，SCI，SPI，UART/USART | 16/32-Bit | ||
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NXP USA Inc. |
888
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 512KB FLASH 80QFP
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Tray | HCS12X | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | LVD，POR，PWM，WDT | HCS12X | 59 | 50MHz | 32K x 8 | 512KB (512K x 8) | Flash | 4K x 8 | 1.72 V ~ 5.5 V | A/D 12x12b | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | 16-Bit | ||
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Maxim Integrated |
582
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT ROMLESS 40DIP
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Tube | 80C | 0°C ~ 70°C (TA) | 40-DIP (0.600"，15.24mm) | 40-PDIP | Brown-out Detect/Reset，POR | 8051 | 32 | 25MHz | 256 x 8 | - | ROMless | - | 4.5 V ~ 5.5 V | - | EBI/EMI，SIO，UART/USART | 8-Bit | ||
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Renesas Electronics America |
278
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 2MB FLASH 100LQFP
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Tray | RX600 | -20°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA，POR，PWM，WDT | RX | 117 | 100MHz | 128K x 8 | 2MB (2M x 8) | Flash | - | 3 V ~ 3.6 V | A/D 16x10b; D/A 2x10b | EBI/EMI，I2C，SCI | 32-Bit | ||
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Maxim Integrated |
251
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 16KB FLASH 40DIP
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Tube | 89C | -40°C ~ 85°C (TA) | 40-DIP (0.600"，15.24mm) | 40-PDIP | Power-Fail Reset，WDT | 8051 | 32 | 25MHz | 1K x 8 | 16KB (16K x 8) | Flash | - | 4.5 V ~ 5.5 V | - | EBI/EMI，SIO，UART/USART | 8-Bit | ||
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Renesas Electronics America |
203
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 512KB FLASH 120LQFP
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Tray | H8 H8SX/1600 | -20°C ~ 75°C (TA) | 120-LQFP | 120-LQFP (14x14) | DMA，LVD，POR，PWM，WDT | H8SX | 75 | 50MHz | 40K x 8 | 512KB (512K x 8) | Flash | - | 3 V ~ 3.6 V | A/D 8x10b; D/A 2x8b | EBI/EMI，I2C，IrDA，SCI，SmartCard，USB | 32-Bit | ||
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Texas Instruments |
456
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 1MB FLASH 144LQFP
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Tray | Hercules RM4 ARM Cortex-R4 | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA，POR，PWM，WDT | ARM Cortex-R4F | 64 | 180MHz | 128K x 8 | 1MB (1M x 8) | Flash | 64K x 8 | 1.14 V ~ 3.6 V | A/D 24x12b | CANbus，I2C，LINbus，MibSPI，SCI，SPI，UART/USART | 16/32-Bit | ||
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NXP USA Inc. |
1,794
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT ROMLESS 196MAPBGA
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Tray | MCF520x | -40°C ~ 85°C (TA) | 196-LBGA | 196-MAPBGA (15x15) | DMA，WDT | Coldfire V2 | 50 | 166.67MHz | 16K x 8 | - | ROMless | - | 1.4 V ~ 3.6 V | - | EBI/EMI，Ethernet，I2C，SPI，UART/USART | 32-Bit | ||
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Maxim Integrated |
424
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 64KB FLASH 40DIP
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Tube | 89C | -40°C ~ 85°C (TA) | 40-DIP (0.600"，15.24mm) | 40-PDIP | Power-Fail Reset，WDT | 8051 | 32 | 25MHz | 1K x 8 | 64KB (64K x 8) | Flash | - | 4.5 V ~ 5.5 V | - | EBI/EMI，SIO，UART/USART | 8-Bit | ||
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NXP USA Inc. |
1,348
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT ROMLESS 256MAPBGA
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Tray | MCF532x | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA，LCD，PWM，WDT | Coldfire V3 | 94 | 240MHz | 32K x 8 | - | ROMless | - | 1.4 V ~ 3.6 V | - | EBI/EMI，Ethernet，I2C，SPI，SSI，UART/USART，USB，USB OTG | 32-Bit | ||
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NXP USA Inc. |
1,852
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 1MB FLASH 112LQFP
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Tray | HCS12X | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 91 | 50MHz | 64K x 8 | 1MB (1M x 8) | Flash | 4K x 8 | 1.72 V ~ 5.5 V | A/D 16x12b | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
1,800
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 1MB FLASH 144LQFP
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Tray | HCS12X | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 119 | 50MHz | 64K x 8 | 1MB (1M x 8) | Flash | 4K x 8 | 1.72 V ~ 5.5 V | A/D 24x12b | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
900
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 64KB FLASH 100LQFP
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Tray | 56F8xx | -40°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | POR，WDT | 56800 | 46 | 80MHz | 4K x 16 | 64KB (32K x 16) | Flash | - | 2.25 V ~ 2.75 V | - | EBI/EMI，SCI，SPI，SSI | 16-Bit | ||
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NXP USA Inc. |
703
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT ROMLESS 160QFP
|
Tray | MCF520x | 0°C ~ 70°C (TA) | 160-BQFP | 160-QFP (28x28) | DMA，WDT | Coldfire V2 | 8 | 40MHz | 8K x 8 | - | ROMless | - | 3 V ~ 3.6 V | - | EBI/EMI，I2C，UART/USART | 32-Bit | ||
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Renesas Electronics America |
152
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 512KB FLASH 176BGA
|
Tray | H8 H8S/2400 | -40°C ~ 85°C (TA) | 176-LFBGA | 176-LFBGA (13x13) | DMA，POR，PWM，WDT | H8S/2600 | 110 | 34MHz | 40K x 8 | 512KB (512K x 8) | Flash | - | 3 V ~ 3.6 V | A/D 8x10b | Ethernet，I2C，LPC，PECI，SCI，SSU，USB | 16-Bit | ||
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NXP USA Inc. |
1,017
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 100LQFP
|
Tray | 56F8xx | -40°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | POR，PWM，WDT | 56800 | 16 | 80MHz | 2K x 16 | 64KB (32K x 16) | Flash | - | 3 V ~ 3.6 V | A/D 8x12b | CANbus，EBI/EMI，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
432
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 1MB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD，POR，PWM，WDT | HCS12X | 91 | 50MHz | 64K x 8 | 1MB (1M x 8) | Flash | 4K x 8 | 1.72 V ~ 5.5 V | A/D 16x12b | CANbus，EBI/EMI，I2C，IrDA，SCI，SPI | 16-Bit | ||
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Texas Instruments |
1,619
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 768KB FLASH 144LQFP
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Tray | TMS470 | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA，POR，PWM，WDT | ARM7 | 86 | 60MHz | 48K x 8 | 768KB (768K x 8) | Flash | - | 1.81 V ~ 2.05 V | A/D 16x10b | CANbus，SCI，SPI | 16/32-Bit | ||
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NXP USA Inc. |
587
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 128KB FLASH 144LQFP
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Tray | 56F8xxx | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | POR，PWM，Temp Sensor，WDT | 56800E | 62 | 60MHz | 6K x 16 | 128KB (64K x 16) | Flash | - | 2.25 V ~ 3.6 V | A/D 16x12b | CANbus，EBI/EMI，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
1,326
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 64KB FLASH 144LQFP
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Tray | 56F8xx | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | POR，PWM，WDT | 56800 | 32 | 80MHz | 2K x 16 | 64KB (32K x 16) | Flash | - | 3 V ~ 3.6 V | A/D 8x12b | CANbus，EBI/EMI，SCI，SPI | 16-Bit |
