- Operating Temperature:
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Discover 220 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | Data Converters | Connectivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | Data Converters | Connectivity | ||
Microchip Technology |
564
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,64K FLASH
|
Tube | -40°C ~ 125°C (TA) | 28-SSOP (0.209",5.30mm Width) | 28-SSOP | 21 | 20K x 8 | 88KB (88K x 8) | A/D 23x12b,D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
500
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,64K FLASH
|
Tray | -40°C ~ 85°C (TA) | 48-TQFP | 48-TQFP (7x7) | 39 | 20K x 8 | 88KB (88K x 8) | A/D 31x12b,D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
549
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
Tube | -40°C ~ 125°C (TA) | 28-UQFN Exposed Pad | 28-UQFN (6x6) | 21 | 20K x 8 | 152KB (152K x 8) | A/D 23x12b,D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
549
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,64K FLASH
|
Tube | -40°C ~ 125°C (TA) | 28-UQFN Exposed Pad | 28-UQFN (6x6) | 21 | 20K x 8 | 88KB (88K x 8) | A/D 23x12b,D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
600
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,64K FLASH
|
Tube | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 53 | 20K x 8 | 88KB (88K x 8) | A/D 34x12b; D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
549
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC DUAL CORE 128K FLASH
|
Tube | -40°C ~ 85°C (TA) | 48-UFQFN Exposed Pad | 48-UQFN (6x6) | 39 | 20K x 8 | 152KB (152K x 8) | A/D 31x12b,D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
549
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC DUAL CORE 64K FLASH 1
|
Tube | -40°C ~ 85°C (TA) | 48-UFQFN Exposed Pad | 48-UQFN (6x6) | 39 | 20K x 8 | 88KB (88K x 8) | A/D 31x12b,D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
657
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
Tube | -40°C ~ 125°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 27 | 20K x 8 | 152KB (152K x 8) | A/D 31x12b,D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
657
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,64K FLASH
|
Tube | -40°C ~ 125°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 27 | 20K x 8 | 88KB (88K x 8) | A/D 32x12b,D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
640
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,64K FLASH
|
Tray | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | 53 | 20K x 8 | 88KB (88K x 8) | A/D 34x12b; D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
559
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
Tube | -40°C ~ 125°C (TA) | 28-SSOP (0.209",5.30mm Width) | 28-SSOP | 21 | 20K x 8 | 152KB (152K x 8) | A/D 23x12b,D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
500
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,64K FLASH
|
Tray | -40°C ~ 85°C (TA) | 48-TQFP | 48-TQFP (7x7) | 39 | 20K x 8 | 88KB (88K x 8) | A/D 31x12b,D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
493
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
Tray | -40°C ~ 85°C (TA) | 48-TQFP | 48-TQFP (7x7) | 39 | 20K x 8 | 152KB (152K x 8) | A/D 31x12b,D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
549
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
Tube | -40°C ~ 125°C (TA) | 28-UQFN Exposed Pad | 28-UQFN (6x6) | 21 | 20K x 8 | 152KB (152K x 8) | A/D 23x12b,D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
600
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
Tube | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 53 | 20K x 8 | 152KB (152K x 8) | A/D 34x12b; D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
600
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,64K FLASH
|
Tube | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 53 | 20K x 8 | 88KB (88K x 8) | A/D 34x12b; D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
549
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC DUAL CORE 128K FLASH
|
Tube | -40°C ~ 85°C (TA) | 48-UFQFN Exposed Pad | 48-UQFN (6x6) | 39 | 20K x 8 | 152KB (152K x 8) | A/D 31x12b,D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
657
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,128K FLAS
|
Tube | -40°C ~ 125°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 27 | 20K x 8 | 152KB (152K x 8) | A/D 31x12b,D/A 4x12b | CANbus,I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
549
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC DUAL CORE 64K FLASH 1
|
Tube | -40°C ~ 125°C (TA) | 48-UFQFN Exposed Pad | 48-UQFN (6x6) | 39 | 20K x 8 | 88KB (88K x 8) | A/D 31x12b,D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART | ||||
Microchip Technology |
710
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC,DUAL CORE,64K FLASH
|
Tray | -40°C ~ 85°C (TA) | 80-TQFP | 80-TQFP (12x12) | 69 | 20K x 8 | 88KB (88K x 8) | A/D 34x12b; D/A 4x12b | I2C,IrDA,LINbus,SPI,UART/USART |