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Discover 220 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | Data Converters | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | Data Converters | Connectivity | |
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC，DUAL CORE，128K FLAS
|
- | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 27 | 20K x 8 | 152KB (152K x 8) | A/D 31x12b，D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
16 BIT DSC，DUAL CORE，64K FLASH
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 27 | 20K x 8 | 88KB (88K x 8) | A/D 32x12b，D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC，DUAL CORE，64K FLASH
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 27 | 20K x 8 | 88KB (88K x 8) | A/D 32x12b，D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC，DUAL CORE，64K FLASH
|
- | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 27 | 20K x 8 | 88KB (88K x 8) | A/D 32x12b，D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
16 BIT DSC，DUAL CORE，128K FLAS
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 28-UQFN Exposed Pad | 28-UQFN (6x6) | 21 | 20K x 8 | 152KB (152K x 8) | A/D 23x12b，D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC，DUAL CORE，128K FLAS
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 28-UQFN Exposed Pad | 28-UQFN (6x6) | 21 | 20K x 8 | 152KB (152K x 8) | A/D 23x12b，D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC，DUAL CORE，128K FLAS
|
- | -40°C ~ 85°C (TA) | 28-UQFN Exposed Pad | 28-UQFN (6x6) | 21 | 20K x 8 | 152KB (152K x 8) | A/D 23x12b，D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
16 BIT DSC，DUAL CORE，128K FLAS
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 27 | 20K x 8 | 152KB (152K x 8) | A/D 31x12b，D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC，DUAL CORE，128K FLAS
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 27 | 20K x 8 | 152KB (152K x 8) | A/D 31x12b，D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC，DUAL CORE，128K FLAS
|
- | -40°C ~ 85°C (TA) | 36-UFQFN Exposed Pad | 36-UQFN (5x5) | 27 | 20K x 8 | 152KB (152K x 8) | A/D 31x12b，D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
16 BIT DSC DUAL CORE 64K FLASH 1
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 48-UFQFN Exposed Pad | 48-UQFN (6x6) | 39 | 20K x 8 | 88KB (88K x 8) | A/D 31x12b，D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC DUAL CORE 64K FLASH 1
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 48-UFQFN Exposed Pad | 48-UQFN (6x6) | 39 | 20K x 8 | 88KB (88K x 8) | A/D 31x12b，D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC DUAL CORE 64K FLASH 1
|
- | -40°C ~ 85°C (TA) | 48-UFQFN Exposed Pad | 48-UQFN (6x6) | 39 | 20K x 8 | 88KB (88K x 8) | A/D 31x12b，D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
1,600
|
3 days |
-
|
MOQ: 1600 MPQ: 1
|
16 BIT DSC，DUAL CORE，64K FLASH
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 48-TQFP | 48-TQFP (7x7) | 39 | 20K x 8 | 88KB (88K x 8) | A/D 31x12b，D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
1,600
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC，DUAL CORE，64K FLASH
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 48-TQFP | 48-TQFP (7x7) | 39 | 20K x 8 | 88KB (88K x 8) | A/D 31x12b，D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
1,600
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC，DUAL CORE，64K FLASH
|
- | -40°C ~ 85°C (TA) | 48-TQFP | 48-TQFP (7x7) | 39 | 20K x 8 | 88KB (88K x 8) | A/D 31x12b，D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
16 BIT DSC，DUAL CORE，64K FLASH
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 53 | 20K x 8 | 88KB (88K x 8) | A/D 34x12b; D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC，DUAL CORE，64K FLASH
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 53 | 20K x 8 | 88KB (88K x 8) | A/D 34x12b; D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC，DUAL CORE，64K FLASH
|
- | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 53 | 20K x 8 | 88KB (88K x 8) | A/D 34x12b; D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | |||
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
16 BIT DSC DUAL CORE 128K FLASH
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 48-UFQFN Exposed Pad | 48-UQFN (6x6) | 39 | 20K x 8 | 152KB (152K x 8) | A/D 31x12b，D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART |
