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Discover 220 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | Data Converters | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | Program Memory Size | Data Converters | Connectivity | |
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Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 53 | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 53 | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
- | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 53 | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | ||
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|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | 53 | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | 53 | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
- | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | 53 | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 3300 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 53 | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 53 | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
3,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
- | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 53 | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | 53 | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | 53 | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
- | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | 53 | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 3300 MPQ: 1
|
16 BIT DSC 512K FLASH 48K + 16K
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 53 | 64K x 8 | 584kB (584k x 8) | A/D 64x12b; D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 512K FLASH 48K + 16K
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 53 | 64K x 8 | 584kB (584k x 8) | A/D 64x12b; D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 512K FLASH 48K + 16K
|
- | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (9x9) | 53 | 64K x 8 | 584kB (584k x 8) | A/D 64x12b; D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
1,200
|
3 days |
-
|
MOQ: 1200 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 80-TQFP | 80-TQFP (12x12) | 69 | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
1,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 80-TQFP | 80-TQFP (12x12) | 69 | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
1,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 256K FLASH 32K + 16K
|
- | -40°C ~ 85°C (TA) | 80-TQFP | 80-TQFP (12x12) | 69 | 48K x 8 | 328kB (328k x 8) | A/D 34x12b; D/A 4x12b | CANbus，I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
16 BIT DSC 512K FLASH 48K + 16K
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | 53 | 64K x 8 | 584kB (584k x 8) | A/D 64x12b; D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART | ||
|
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
16 BIT DSC 512K FLASH 48K + 16K
|
Cut Tape (CT) | -40°C ~ 85°C (TA) | 64-TQFP | 64-TQFP (10x10) | 53 | 64K x 8 | 584kB (584k x 8) | A/D 64x12b; D/A 4x12b | I2C，IrDA，LINbus，SPI，UART/USART |
