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Discover 26 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
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Microchip Technology |
988
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 512KB FLASH 64LQFP
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Tray | SAM G55 | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA，I2S，POR，PWM，WDT | ARM Cortex-M4 | 48 | 120MHz | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 8x12b | Internal | I2C，SPI，UART/USART，USB | ||
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Microchip Technology |
Inquiry
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- |
-
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MOQ: 3500 MPQ: 1
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IC MCU 32BIT 512KB FLASH 64QFN
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Tape & Reel (TR) | SAM G55 | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (7.5x7.5) | DMA，I2S，POR，PWM，WDT | ARM Cortex-M4 | 48 | 120MHz | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 8x12b | Internal | I2C，SPI，UART/USART，USB | ||
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Infineon Technologies |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 2.5MB FLASH 176LQFP
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Tape & Reel (TR) | TC17xx | -40°C ~ 125°C (TA) | 176-LQFP | PG-LQFP-176-20 | DMA，POR，WDT | TriCore | 86 | 180MHz | 2.5MB (2.5M x 8) | 128K x 8 | 1.17 V ~ 3.63 V | A/D 8x10b，32x12b | External | ASC，CANbus，FlexRay，MLI，MSC，SSC | ||
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Infineon Technologies |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 2.5MB FLASH 176LQFP
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Tape & Reel (TR) | TC17xx | -40°C ~ 125°C (TA) | 176-LQFP | PG-LQFP-176-20 | DMA，POR，WDT | TriCore | 86 | 180MHz | 2.5MB (2.5M x 8) | 128K x 8 | 1.17 V ~ 3.63 V | A/D 8x10b，32x12b | External | ASC，CANbus，FlexRay，MLI，MSC，SSC | ||
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Infineon Technologies |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
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IC MCU 32BIT FLASH 292LFBGA
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Tape & Reel (TR) | TC17xx | -40°C ~ 125°C (TA) | 292-LFBGA | 292-LFBGA (17x17) | DMA，POR，WDT | TriCore | 91 | 180MHz | 2.5MB (2.5M x 8) | 64K x 8 | 1.235 V ~ 3.47 V | A/D 8x10b，32x12b | External | ASC，CANbus，EBI/EMI，MLI，MSC，SSC | ||
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Infineon Technologies |
Inquiry
|
- |
-
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MOQ: 500 MPQ: 1
|
IC MCU 32BIT 2.5MB FLASH 176LQFP
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Tape & Reel (TR) | TC17xx | -40°C ~ 125°C (TA) | 176-LQFP | PG-LQFP-176-20 | DMA，POR，WDT | TriCore | 86 | 180MHz | 2.5MB (2.5M x 8) | 128K x 8 | 1.17 V ~ 3.63 V | A/D 8x10b，32x12b | External | ASC，CANbus，FlexRay，MLI，MSC，SSC | ||
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Microchip Technology |
3,500
|
3 days |
-
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MOQ: 3500 MPQ: 1
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IC MCU 32BIT 512KB FLASH 64QFN
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Tape & Reel (TR) | SAM G55 | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (7.5x7.5) | DMA，I2S，POR，PWM，WDT | ARM Cortex-M4 | 48 | 120MHz | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 8x12b | Internal | I2C，SPI，UART/USART，USB | |||
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Microchip Technology |
5,238
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 512KB FLASH 64QFN
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Cut Tape (CT) | SAM G55 | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (7.5x7.5) | DMA，I2S，POR，PWM，WDT | ARM Cortex-M4 | 48 | 120MHz | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 8x12b | Internal | I2C，SPI，UART/USART，USB | |||
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Microchip Technology |
5,238
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 512KB FLASH 64QFN
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- | SAM G55 | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (7.5x7.5) | DMA，I2S，POR，PWM，WDT | ARM Cortex-M4 | 48 | 120MHz | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 8x12b | Internal | I2C，SPI，UART/USART，USB | |||
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Microchip Technology |
1,200
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 512KB FLASH 64QFN
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Tray | SAM G55 | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (7.5x7.5) | DMA，I2S，POR，PWM，WDT | ARM Cortex-M4 | 48 | 120MHz | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 8x12b | Internal | I2C，SPI，UART/USART，USB | |||
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Microchip Technology |
530
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 512KB FLASH 64LQFP
|
Tray | SAM G55 | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA，I2S，POR，PWM，WDT | ARM Cortex-M4 | 48 | 120MHz | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 8x12b | Internal | I2C，SPI，UART/USART，USB | |||
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Microchip Technology |
713
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 64QFN
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Tray | SAM G55 | -40°C ~ 85°C (TA) | 64-VFQFN Exposed Pad | 64-QFN (7.5x7.5) | DMA，I2S，POR，PWM，WDT | ARM Cortex-M4 | 48 | 120MHz | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 8x12b | Internal | I2C，SPI，UART/USART，USB | |||
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Microchip Technology |
Inquiry
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- |
-
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MOQ: 5000 MPQ: 1
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IC MCU 32BIT 512KB FLASH 49WLCSP
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Tape & Reel (TR) | SAM G55 | -40°C ~ 85°C (TA) | 49-UFBGA，WLCSP | 49-WLCSP (2.84x2.84) | DMA，I2S，POR，PWM，WDT | ARM Cortex-M4 | 38 | 120MHz | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 8x12b | Internal | I2C，SPI，UART/USART，USB | |||
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Microchip Technology |
4,390
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 512KB FLASH 49WLCSP
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Cut Tape (CT) | SAM G55 | -40°C ~ 85°C (TA) | 49-UFBGA，WLCSP | 49-WLCSP (2.84x2.84) | DMA，I2S，POR，PWM，WDT | ARM Cortex-M4 | 38 | 120MHz | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 8x12b | Internal | I2C，SPI，UART/USART，USB | |||
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Microchip Technology |
4,390
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 49WLCSP
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- | SAM G55 | -40°C ~ 85°C (TA) | 49-UFBGA，WLCSP | 49-WLCSP (2.84x2.84) | DMA，I2S，POR，PWM，WDT | ARM Cortex-M4 | 38 | 120MHz | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 8x12b | Internal | I2C，SPI，UART/USART，USB | |||
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Microchip Technology |
Inquiry
|
- |
-
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MOQ: 1500 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 64LQFP
|
Tape & Reel (TR) | SAM G55 | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA，I2S，POR，PWM，WDT | ARM Cortex-M4 | 48 | 120MHz | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 8x12b | Internal | I2C，SPI，UART/USART，USB | |||
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Microchip Technology |
804
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 64LQFP
|
Cut Tape (CT) | SAM G55 | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA，I2S，POR，PWM，WDT | ARM Cortex-M4 | 48 | 120MHz | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 8x12b | Internal | I2C，SPI，UART/USART，USB | |||
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Microchip Technology |
804
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 64LQFP
|
- | SAM G55 | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA，I2S，POR，PWM，WDT | ARM Cortex-M4 | 48 | 120MHz | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 8x12b | Internal | I2C，SPI，UART/USART，USB | |||
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Microchip Technology |
Inquiry
|
- |
-
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MOQ: 1500 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 64LQFP
|
Tape & Reel (TR) | SAM G55 | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA，I2S，POR，PWM，WDT | ARM Cortex-M4 | 48 | 120MHz | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 8x12b | Internal | I2C，SPI，UART/USART，USB | |||
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Microchip Technology |
175
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 512KB FLASH 64LQFP
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Cut Tape (CT) | SAM G55 | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA，I2S，POR，PWM，WDT | ARM Cortex-M4 | 48 | 120MHz | 512KB (512K x 8) | - | 1.62 V ~ 3.6 V | A/D 8x12b | Internal | I2C，SPI，UART/USART，USB |
