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- Peripherals：
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- Voltage - Supply (Vcc/Vdd)：
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- Oscillator Type：
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- Selected conditions:
Discover 904 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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XMOS |
Inquiry
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MOQ: 168 MPQ: 1
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IC MCU 32BIT ROMLESS 324FBGA
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Tray | XU | 0°C ~ 70°C (TA) | 324-FBGA | 324-FBGA (15x15) | - | XCore | 208 | 4000MIPS | - | ROMless | - | 0.95 V ~ 3.6 V | - | External | USB | 32-Bit 32-Core | |||
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XMOS |
Inquiry
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-
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MOQ: 168 MPQ: 1
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IC MCU 32BIT 2MB FLASH 324FBGA
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Tray | XUF | 0°C ~ 70°C (TA) | 324-FBGA | 324-FBGA (15x15) | - | XCore | 208 | 4000MIPS | 2MB (2M x 8) | Flash | - | 0.95 V ~ 3.6 V | - | External | USB | 32-Bit 32-Core | |||
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XMOS |
Inquiry
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-
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MOQ: 168 MPQ: 1
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IC MCU 32BIT ROMLESS 324FBGA
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Tray | XU | -40°C ~ 85°C (TA) | 324-FBGA | 324-FBGA (15x15) | - | XCore | 208 | 4000MIPS | - | ROMless | - | 0.95 V ~ 3.6 V | - | External | USB | 32-Bit 32-Core | |||
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XMOS |
Inquiry
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-
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MOQ: 168 MPQ: 1
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IC MCU 32BIT 2MB FLASH 324FBGA
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Tray | XUF | -40°C ~ 85°C (TA) | 324-FBGA | 324-FBGA (15x15) | - | XCore | 208 | 4000MIPS | 2MB (2M x 8) | Flash | - | 0.95 V ~ 3.6 V | - | External | USB | 32-Bit 32-Core | |||
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Cypress Semiconductor Corp |
Inquiry
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MOQ: 36 MPQ: 1
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IC MCU 32BIT AUTO 208-EXLQFP
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- | Traveo S6J3200 | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-TQFP (28x28) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-R5F | 120 | 240MHz | 2.112MB (2.112M x 8) | Flash | - | 1.15 V ~ 5.5 V | A/D 50x12b | Internal | CANbus，CSIO，Ethernet，I2C，LINbus，SPI，UART/USART | 32-Bit | |||
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Cypress Semiconductor Corp |
Inquiry
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- |
-
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MOQ: 36 MPQ: 1
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IC MCU 32BIT AUTO 208-EXLQFP
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- | Traveo S6J3200 | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-TQFP (28x28) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-R5F | 120 | 240MHz | 2.112MB (2.112M x 8) | Flash | - | 1.15 V ~ 5.5 V | A/D 50x12b | Internal | CANbus，CSIO，Ethernet，I2C，LINbus，SPI，UART/USART | 32-Bit | |||
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Cypress Semiconductor Corp |
Inquiry
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-
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MOQ: 1 MPQ: 1
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IC MCU AUTO 208EX-LQFP
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- | Traveo S6J3200 | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-TQFP (28x28) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-R5F | 120 | 240MHz | 2.112MB (2.112M x 8) | Flash | - | 1.15 V ~ 5.5 V | A/D 50x12b | Internal | CANbus，CSIO，Ethernet，I2C，LINbus，SPI，UART/USART | 32-Bit | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
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32 BITDUAL CORE3M FLASH384 RA
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
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DUAL CORE 3M FLASH 384K RAM F
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
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DUAL CORE 4M FLASH 512
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Tape & Reel (TR) | MPC57xx | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/160MHz | 4MB (4M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 512K R
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 512
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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32 BITDUAL CORE4M FLAS
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Tape & Reel (TR) | MPC57xx | -40°C ~ 105°C (TA) | 324-LBGA | 324-MAPBGA (19x19) | DMA，LVD，POR，WDT | e200z2，e200z4 | 246 | 80MHz/160MHz | 4MB (4M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
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DUAL CORE 4M FLASH 512K RAM F
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Tape & Reel (TR) | MPC57xx | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/160MHz | 4MB (4M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 450 MPQ: 1
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DUAL CORE 4M FLASH 512K RAM F
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/160MHz | 4MB (4M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 84 MPQ: 1
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32 BITDUAL CORE4M FLAS
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 324-LBGA | 324-MAPBGA (19x19) | DMA，LVD，POR，WDT | e200z2，e200z4 | 246 | 80MHz/160MHz | 4MB (4M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 84 MPQ: 1
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32 BITDUAL CORE4M FLAS
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 324-LBGA | 324-MAPBGA (19x19) | DMA，LVD，POR，WDT | e200z2，e200z4 | 246 | 80MHz/160MHz | 4MB (4M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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POWER ARCH CORES 8MB FL
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | - | 264MHz | 8MB (8M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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POWER ARCH CORES 8MB FL
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | - | 264MHz | 8MB (8M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | |||
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Cypress Semiconductor Corp |
Inquiry
|
- |
-
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MOQ: 36 MPQ: 1
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IC MCU 32BIT AUTO 216-EXLQFP
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- | Traveo S6J3200 | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-TQFP (28x28) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-R5F | 120 | 240MHz | 2.112MB (2.112M x 8) | Flash | - | 1.15 V ~ 5.5 V | A/D 50x12b | Internal | CANbus，CSIO，Ethernet，I2C，LINbus，SPI，UART/USART | 32-Bit |
