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- Supplier Device Package：
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- Peripherals：
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- Core Processor：
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- EEPROM Size：
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- Voltage - Supply (Vcc/Vdd)：
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- Data Converters：
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- Oscillator Type：
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- Connectivity：
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- Selected conditions:
Discover 904 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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NXP USA Inc. |
Inquiry
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MOQ: 200 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORES
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | - | 264MHz | 8MB (8M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
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MOQ: 200 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORES
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | - | 264MHz | 8MB (8M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
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MOQ: 200 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORES
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | - | 264MHz | 8MB (8M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
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MOQ: 200 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORES
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | - | 264MHz | 8MB (8M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORES
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | - | 264MHz | 8MB (8M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORES
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | - | 264MHz | 8MB (8M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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POWER ARCH CORES 8MB FL
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | - | 264MHz | 8MB (8M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | |||
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NXP USA Inc. |
Inquiry
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-
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MOQ: 200 MPQ: 1
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POWER ARCH CORES 8MB FL
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | - | 264MHz | 8MB (8M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | |||
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XMOS |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 2MB FLASH 374FBGA
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Tray | XEF | 0°C ~ 70°C (TA) | 374-LFBGA | 374-FBGA (18x18) | - | XCore | 176 | 4000MIPS | 2MB (2M x 8) | Flash | - | 0.95 V ~ 3.6 V | - | External | RGMII，USB | 32-Bit 32-Core | |||
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Maxim Integrated |
Inquiry
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MOQ: 0 MPQ: 1
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IC MCU 32BIT 2MB FLASH 100QFP
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- | DARWIN | -20°C ~ 85°C (TA) | - | 100-QFP | Brown-out Detect/Reset，POR，PWM，WDT | ARM Cortex-M4F | 66 | 96MHz | 2MB (2M x 8) | Flash | - | 1.14 V ~ 3.6 V | A/D 4x10b | Internal | 1-Wire，I2C，SPI，UART/USART，USB | 32-Bit | ||
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Maxim Integrated |
Inquiry
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- |
-
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MOQ: 0 MPQ: 1
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IC MCU 32BIT 2MB FLASH 100TQFP
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Tube | DARWIN | -20°C ~ 85°C (TA) | - | - | Brown-out Detect/Reset，POR，PWM，TPU，WDT | ARM Cortex-M4F | 66 | 96MHz | 2MB (2M x 8) | Flash | - | 1.14 V ~ 3.6 V | A/D 4x10b | Internal | 1-Wire，I2C，SPI，UART/USART，USB | 32-Bit | ||
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Cypress Semiconductor Corp |
Inquiry
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- |
-
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MOQ: 0 MPQ: 1
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IC MCU AUTO EX-LQFP
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- | Traveo S6J3200 | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-TQFP (28x28) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-R5F | 120 | 240MHz | 2.112MB (2.112M x 8) | Flash | - | 1.15 V ~ 5.5 V | A/D 50x12b | Internal | CANbus，CSIO，Ethernet，I2C，LINbus，SPI，UART/USART | 32-Bit | ||
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Cypress Semiconductor Corp |
Inquiry
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- |
-
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MOQ: 0 MPQ: 1
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IC MCU AUTO 216EX-LQFP
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- | Traveo S6J3200 | -40°C ~ 105°C (TA) | 216-LQFP | 216-TEQFP (24x24) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-R5F | 120 | 240MHz | 2.112MB (2.112M x 8) | Flash | - | 1.15 V ~ 5.5 V | A/D 50x12b | Internal | CANbus，CSIO，Ethernet，I2C，LINbus，SPI，UART/USART | 32-Bit | ||
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Cypress Semiconductor Corp |
Inquiry
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- |
-
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MOQ: 0 MPQ: 1
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IC MCU AUTO EX-LQFP
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- | Traveo S6J3200 | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-TQFP (28x28) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-R5F | 120 | 240MHz | 2.112MB (2.112M x 8) | Flash | - | 1.15 V ~ 5.5 V | A/D 50x12b | Internal | CANbus，CSIO，Ethernet，I2C，LINbus，SPI，UART/USART | 32-Bit | ||
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Cypress Semiconductor Corp |
Inquiry
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- |
-
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MOQ: 0 MPQ: 1
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IC MCU AUTO
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- | Traveo S6J3200 | -40°C ~ 105°C (TA) | 216-LQFP | 216-TEQFP (24x24) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-R5F | 128 | 240MHz | 2.112MB (2.112M x 8) | Flash | - | 1.15 V ~ 5.5 V | A/D 50x12b | Internal | CANbus，CSIO，Ethernet，I2C，LINbus，SPI，UART/USART | 32-Bit | ||
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Cypress Semiconductor Corp |
Inquiry
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- |
-
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MOQ: 0 MPQ: 1
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IC MCU AUTO
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- | Traveo S6J3200 | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-TQFP (28x28) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-R5F | 120 | 240MHz | 2.112MB (2.112M x 8) | Flash | - | 1.15 V ~ 5.5 V | A/D 50x12b | Internal | CANbus，CSIO，Ethernet，I2C，LINbus，SPI，UART/USART | 32-Bit | ||
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XMOS |
Inquiry
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- |
-
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MOQ: 168 MPQ: 1
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IC MCU 32BIT ROMLESS 324FBGA
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Tray | XU | 0°C ~ 70°C (TA) | 324-FBGA | 324-FBGA (15x15) | - | XCore | 208 | 4000MIPS | - | ROMless | - | 0.95 V ~ 3.6 V | - | External | USB | 32-Bit 24-Core | |||
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XMOS |
Inquiry
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- |
-
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MOQ: 168 MPQ: 1
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IC MCU 32BIT 2MB FLASH 324FBGA
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Tray | XUF | 0°C ~ 70°C (TA) | 324-FBGA | 324-FBGA (15x15) | - | XCore | 208 | 4000MIPS | 2MB (2M x 8) | Flash | - | 0.95 V ~ 3.6 V | - | External | USB | 32-Bit 24-Core | |||
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XMOS |
Inquiry
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- |
-
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MOQ: 168 MPQ: 1
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IC MCU 32BIT ROMLESS 324FBGA
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Tray | XU | -40°C ~ 85°C (TA) | 324-FBGA | 324-FBGA (15x15) | - | XCore | 208 | 4000MIPS | - | ROMless | - | 0.95 V ~ 3.6 V | - | External | USB | 32-Bit 24-Core | |||
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XMOS |
Inquiry
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- |
-
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MOQ: 168 MPQ: 1
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IC MCU 32BIT 2MB FLASH 324FBGA
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Tray | XUF | -40°C ~ 85°C (TA) | 324-FBGA | 324-FBGA (15x15) | - | XCore | 208 | 4000MIPS | 2MB (2M x 8) | Flash | - | 0.95 V ~ 3.6 V | - | External | USB | 32-Bit 24-Core |
