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- Peripherals：
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- Core Processor：
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- Program Memory Type：
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- EEPROM Size：
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- Voltage - Supply (Vcc/Vdd)：
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- Oscillator Type：
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- Selected conditions:
Discover 904 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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NXP USA Inc. |
Inquiry
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MOQ: 500 MPQ: 1
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32 BITDUAL CORE3M FLASH512K R
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
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NXP USA Inc. |
Inquiry
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MOQ: 450 MPQ: 1
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32 BITDUAL CORE3M FLASH384 RA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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MOQ: 500 MPQ: 1
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DUAL CORE 4M FLASH 512
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 4MB (4M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
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NXP USA Inc. |
Inquiry
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MOQ: 450 MPQ: 1
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DUAL CORE 3M FLASH 384K RAM F
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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-
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MOQ: 450 MPQ: 1
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DUAL CORE 4M FLASH 512
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 4MB (4M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI | 32-Bit Dual-Core | |||
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NXP USA Inc. |
Inquiry
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MOQ: 500 MPQ: 1
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DUAL CORE 4M FLASH 512K RAM F
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Tape & Reel (TR) | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 4MB (4M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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32 BIT，4MB FLASH，512K
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 4MB (4M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
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NXP USA Inc. |
Inquiry
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-
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MOQ: 500 MPQ: 1
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DUAL CORE 4M FLASH 512K RAM F
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Tape & Reel (TR) | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 4MB (4M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 450 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 512
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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DUAL CORE 4M FLASH 512K RAM F
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 4MB (4M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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DUAL CORE 4M FLASH 512K RAM F
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Tape & Reel (TR) | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 4MB (4M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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32 BIT，4MB FLASH，512K
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 4MB (4M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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DUAL CORE 4M FLASH 512K RAM F
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 4MB (4M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
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DUAL CORE 4M FLASH 512K RAM F
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 4MB (4M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORES
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | - | 264MHz | 8MB (8M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORES
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | - | 264MHz | 8MB (8M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORES
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | - | 264MHz | 8MB (8M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORES
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | - | 264MHz | 8MB (8M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORES
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | - | 264MHz | 8MB (8M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORES
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | - | 264MHz | 8MB (8M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 16b Sigma-Delta，eQADC | Internal | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | 32-Bit Tri-Core |
