- Manufacturer：
-
- Series：
-
- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- Peripherals：
-
- Core Processor：
-
- Number of I/O：
-
- Speed：
-
- Program Memory Size：
-
- Program Memory Type：
-
- EEPROM Size：
-
- Voltage - Supply (Vcc/Vdd)：
-
- Data Converters：
-
- Oscillator Type：
-
- Connectivity：
-
- Selected conditions:
Discover 904 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
32 BITDUAL CORE3M FLASH384 RA
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
|
|
|
Cypress Semiconductor Corp |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU AUTO 216EX-LQFP
|
- | Traveo S6J3200 | -40°C ~ 105°C (TA) | 216-LQFP | 216-TEQFP (24x24) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-R5F | 120 | 240MHz | 2.112MB (2.112M x 8) | Flash | - | 1.15 V ~ 5.5 V | A/D 50x12b | Internal | CANbus，CSIO，Ethernet，I2C，LINbus，SPI，UART/USART | 32-Bit | ||
|
|
|
Cypress Semiconductor Corp |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU AUTO 208EX-LQFP
|
- | Traveo S6J3200 | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-TQFP (28x28) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-R5F | 120 | 240MHz | 2.112MB (2.112M x 8) | Flash | - | 1.15 V ~ 5.5 V | A/D 50x12b | Internal | CANbus，CSIO，Ethernet，I2C，LINbus，SPI，UART/USART | 32-Bit | ||
|
|
|
Cypress Semiconductor Corp |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU AUTO 208EX-LQFP
|
- | Traveo S6J3200 | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-TQFP (28x28) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-R5F | 120 | 240MHz | 2.112MB (2.112M x 8) | Flash | - | 1.15 V ~ 5.5 V | A/D 50x12b | Internal | CANbus，CSIO，Ethernet，I2C，LINbus，SPI，UART/USART | 32-Bit | ||
|
|
|
Cypress Semiconductor Corp |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU AUTO 216EX-LQFP
|
- | Traveo S6J3200 | -40°C ~ 105°C (TA) | 216-LQFP | 216-TEQFP (24x24) | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-R5F | 120 | 240MHz | 2.112MB (2.112M x 8) | Flash | - | 1.15 V ~ 5.5 V | A/D 50x12b | Internal | CANbus，CSIO，Ethernet，I2C，LINbus，SPI，UART/USART | 32-Bit | ||
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 384
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，LVD，POR，WDT | e200z2，e200z4 | - | 80MHz/160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
DUAL CORE，3M FLASH，256
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，LVD，POR，WDT | e200z2，e200z4 | - | 80MHz/160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 880 MPQ: 1
|
DUAL CORE，3M FLASH，256
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，LVD，POR，WDT | e200z2，e200z4 | - | 80MHz，160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
DUAL CORE 3M FLASH 384K RAM F
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
32 BIT3M FLASH384 RAM
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 512K R
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，LVD，POR，WDT | e200z2，e200z4 | - | 80MHz/160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 512
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，LVD，POR，WDT | e200z2，e200z4 | - | 80MHz/160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
DUAL CORE，3M FLASH，384
|
Tray | MPC57xx | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
DUAL CORE 3M FLASH 384K RAM F
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
DUAL CORE 3M FLASH 384K RAM F
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | ||
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
DUAL CORE，3M FLASH，384
|
Tray | MPC57xx | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz，160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
32 BIT3M FLASH384 RAM
|
Tray | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz，160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
DUAL CORE 3M FLASH 384K RAM F
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
DUAL CORE 3M FLASH 512K RAM F
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core | |||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
32 BIT3M FLASH512K RAM
|
Tray | MPC57xx | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/160MHz | 3MB (3M x 8) | Flash | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | 32-Bit Dual-Core |
