- Manufacturer:
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- Series:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Peripherals:
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- Core Processor:
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- RAM Size:
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- Program Memory Size:
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- Program Memory Type:
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- EEPROM Size:
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- Voltage - Supply (Vcc/Vdd):
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- Data Converters:
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- Oscillator Type:
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- Connectivity:
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- Core Size:
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- Selected conditions:
Discover 324 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | ||
NXP USA Inc. |
272
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM,WDT | HCS12 | 25MHz | 12K x 8 | 256KB (256K x 8) | Flash | 4K x 8 | 2.35 V ~ 5.25 V | A/D 8x10b | Internal | CANbus,I2C,SCI,SPI | 16-Bit | ||||
Renesas Electronics America |
17
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 512KB FLASH 144QFP
|
Tray | SuperH SH7280 | -40°C ~ 85°C (TA) | 144-LQFP | 144-LFQFP (20x20) | DMA,PWM,WDT | SH2A | 100MHz | 24K x 8 | 512KB (512K x 8) | Flash | - | 3 V ~ 5.5 V | A/D 8x12b | External | I2C,SCI,SSU,USB | 32-Bit | ||||
NXP USA Inc. |
43
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 768KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 50MHz | 48K x 8 | 768KB (768K x 8) | Flash | 4K x 8 | 1.72 V ~ 5.5 V | A/D 16x12b | External | CANbus,EBI/EMI,I2C,IrDA,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
97
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 80MHz | 16K x 8 | 256KB (256K x 8) | Flash | 4K x 8 | 2.35 V ~ 5.5 V | A/D 16x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
81
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM,WDT | HCS12 | 25MHz | 8K x 8 | 128KB (128K x 8) | Flash | 2K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
79
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM,WDT | HCS12 | 25MHz | 8K x 8 | 128KB (128K x 8) | Flash | 2K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
80
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM,WDT | HCS12 | 25MHz | 12K x 8 | 256KB (256K x 8) | Flash | 4K x 8 | 2.35 V ~ 5.25 V | A/D 8x10b | Internal | CANbus,I2C,SCI,SPI | 16-Bit | ||||
Infineon Technologies |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 144LQFP
|
Tray | XMC4000 | -40°C ~ 85°C (TA) | 144-LQFP Exposed Pad | 144-LQFP (20x20) | DMA,I2S,LED,POR,PWM,WDT | ARM Cortex-M4 | 120MHz | 160K x 8 | 1MB (1M x 8) | Flash | - | 3.13 V ~ 3.63 V | A/D 32x12b,D/A 2x12b | Internal | CANbus,EBI/EMI,Ethernet,I2C,LINbus,SPI,UART,USB | 32-Bit | ||||
NXP USA Inc. |
7
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | POR,PWM,WDT | HCS12 | 25MHz | 8K x 8 | 128KB (128K x 8) | Flash | - | 2.35 V ~ 2.75 V | A/D 16x10b; D/A 2x8b | Internal | EBI/EMI,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM,WDT | HCS12 | 25MHz | 4K x 8 | 64KB (64K x 8) | Flash | 1K x 8 | 2.35 V ~ 5.25 V | A/D 8x10b | Internal | CANbus,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM,WDT | HCS12 | 25MHz | 12K x 8 | 512KB (512K x 8) | Flash | 4K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | CANbus,I2C,SCI,SPI | 16-Bit | ||||
Renesas Electronics America |
3
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 768KB FLASH 144QFP
|
Tray | SuperH SH7280 | -20°C ~ 85°C (TA) | 144-LQFP | 144-LFQFP (20x20) | DMA,PWM,WDT | SH2A | 100MHz | 32K x 8 | 768KB (768K x 8) | Flash | - | 3 V ~ 5.5 V | A/D 8x12b | External | I2C,SCI,SSU,USB | 32-Bit | ||||
NXP USA Inc. |
15
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | POR,PWM,WDT | HCS12 | 25MHz | 16K x 8 | 256KB (256K x 8) | Flash | - | 2.35 V ~ 2.75 V | A/D 16x10b; D/A 2x8b | Internal | EBI/EMI,I2C,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
2
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 80MHz | 20K x 8 | 512KB (512K x 8) | Flash | 4K x 8 | 2.35 V ~ 5.5 V | A/D 16x10b | External | CANbus,EBI/EMI,I2C,IrDA,LINbus,SCI,SPI | 16-Bit | ||||
Infineon Technologies |
Inquiry
|
- |
-
|
MOQ: 360 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 144LQFP
|
Tray | XMC4000 | -40°C ~ 85°C (TA) | 144-LQFP Exposed Pad | 144-LQFP (20x20) | DMA,I2S,LED,POR,PWM,WDT | ARM Cortex-M4 | 120MHz | 160K x 8 | 768KB (768K x 8) | Flash | - | 3.13 V ~ 3.63 V | A/D 32x12b,D/A 2x12b | Internal | CANbus,EBI/EMI,Ethernet,I2C,LINbus,SPI,UART,USB | 32-Bit | ||||
Infineon Technologies |
Inquiry
|
- |
-
|
MOQ: 360 MPQ: 1
|
IC MCU 32BIT 1MB FLASH 144LQFP
|
Tray | XMC4000 | -40°C ~ 125°C (TA) | 144-LQFP Exposed Pad | 144-LQFP (20x20) | DMA,I2S,LED,POR,PWM,WDT | ARM Cortex-M4 | 120MHz | 160K x 8 | 768KB (768K x 8) | Flash | - | 3.13 V ~ 3.63 V | A/D 32x12b,D/A 2x12b | Internal | CANbus,EBI/EMI,Ethernet,I2C,LINbus,SPI,UART,USB | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 112LQFP
|
Tray | HCS12X | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 40MHz | 8K x 8 | 128KB (128K x 8) | Flash | - | 1.72 V ~ 5.5 V | A/D 16x12b | External | CANbus,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
16-BIT MCU S12X CORE 256KB FLA
|
Tray | HCS12X | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 40MHz | 12K x 8 | 256KB (256K x 8) | Flash | - | 1.72 V ~ 5.5 V | A/D 16x12b | External | CANbus,SCI,SPI | 16-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
16-BIT MCU S12X CORE 512KB FLA
|
Tape & Reel (TR) | HCS12X | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD,POR,PWM,WDT | HCS12X | 50MHz | 32K x 8 | 512KB (512K x 8) | Flash | 4K x 8 | 1.72 V ~ 5.5 V | A/D 16x12b | External | CANbus,EBI/EMI,I2C,IrDA,SCI,SPI | 16-Bit | ||||
Infineon Technologies |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 32BIT FLASH 292LFBGA
|
Tape & Reel (TR) | TC17xx | -40°C ~ 125°C (TA) | 292-LFBGA | 292-LFBGA (17x17) | DMA,POR,WDT | TriCore | 180MHz | 176K x 8 | 2.5MB (2.5M x 8) | Flash | 64K x 8 | 1.235 V ~ 3.47 V | A/D 8x10b,32x12b | External | ASC,CANbus,EBI/EMI,MLI,MSC,SSC | 32-Bit |