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Discover 100 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | |
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NXP USA Inc. |
Inquiry
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MOQ: 200 MPQ: 1
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DUAL CORE 6M FLASH 768K RAM F
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Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | 129 | 80MHz/160MHz | 768K x 8 | 6MB (6M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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DUAL CORE 4M FLASH 512K RAM F
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Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | 129 | 80MHz/160MHz | 512K x 8 | 4MB (4M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | |||
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NXP USA Inc. |
Inquiry
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-
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MOQ: 200 MPQ: 1
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DUAL CORE 6M FLASH 768K RAM F
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Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | 129 | 80MHz/160MHz | 768K x 8 | 6MB (6M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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DUAL CORE 4M FLASH 512K RAM F
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Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | 129 | 80MHz/160MHz | 512K x 8 | 4MB (4M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
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DUAL CORE 2M FLASH 256
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，I2S，POR，WDT | - | 80MHz，160MHz | 256K x 8 | 2MB (2M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
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32 BITDUAL CORE3M FLASH384 RA
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | 178 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
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DUAL CORE 3M FLASH 384K RAM F
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | 178 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
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DUAL CORE 4M FLASH 512
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Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | 178 | 80MHz/160MHz | 512K x 8 | 4MB (4M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 512K R
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | 178 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 512
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | 178 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | |||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 500 MPQ: 1
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32 BITDUAL CORE4M FLAS
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Tape & Reel (TR) | -40°C ~ 105°C (TA) | 324-LBGA | 324-MAPBGA (19x19) | DMA，LVD，POR，WDT | 246 | 80MHz/160MHz | 512K x 8 | 4MB (4M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
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DUAL CORE，6M FLASH，768
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | 178 | 80MHz/160MHz | 768K x 8 | 6MB (6M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
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DUAL CORE 6M FLASH 768K RAM F
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Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | 178 | 80MHz/160MHz | 768K x 8 | 6MB (6M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 450 MPQ: 1
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DUAL CORE，6M FLASH，768
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Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | 178 | 80MHz/160MHz | 768K x 8 | 6MB (6M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | |||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 450 MPQ: 1
|
DUAL CORE 6M FLASH 768K RAM F
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Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | 178 | 80MHz/160MHz | 768K x 8 | 6MB (6M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | |||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 450 MPQ: 1
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NXP 32-BIT MCU 6MB FLASH 160MH
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Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | 178 | 80MHz/160MHz | 768K x 8 | 6MB (6M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | |||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1000 MPQ: 1
|
DUAL CORE 4M FLASH 512K RAM F
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Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | 178 | 80MHz/160MHz | 512K x 8 | 4MB (4M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | |||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 450 MPQ: 1
|
DUAL CORE 4M FLASH 512K RAM F
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Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | 178 | 80MHz/160MHz | 512K x 8 | 4MB (4M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | |||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 84 MPQ: 1
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32 BITDUAL CORE4M FLAS
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Tray | -40°C ~ 105°C (TA) | 324-LBGA | 324-MAPBGA (19x19) | DMA，LVD，POR，WDT | 246 | 80MHz/160MHz | 512K x 8 | 4MB (4M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | |||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 84 MPQ: 1
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32 BITDUAL CORE4M FLAS
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Tray | -40°C ~ 125°C (TA) | 324-LBGA | 324-MAPBGA (19x19) | DMA，LVD，POR，WDT | 246 | 80MHz/160MHz | 512K x 8 | 4MB (4M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG |
