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Discover 2,664 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
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NXP USA Inc. |
5,000
|
3 days |
-
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MOQ: 5000 MPQ: 1
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KINETIS KL26: 48MHZ CORTEX-M0+ U
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Tape & Reel (TR) | Kinetis KL2 | -40°C ~ 85°C (TA) | 36-UFBGA，WLCSP | 36-WLCSP (2.37x2.46) | Brown-out Detect/Reset，DMA，I2S，LVD，POR，PWM，WDT | 27 | 48MHz | 16K x 8 | 128KB (128K x 8) | - | 1.71 V ~ 3.6 V | A/D 12bit SAR，D/A 12bit | Internal | I2C，LINbus，SPI，UART/USART，USB，USB OTG | ||
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NXP USA Inc. |
5,000
|
3 days |
-
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MOQ: 1 MPQ: 1
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KINETIS KL26: 48MHZ CORTEX-M0+ U
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Cut Tape (CT) | Kinetis KL2 | -40°C ~ 85°C (TA) | 36-UFBGA，WLCSP | 36-WLCSP (2.37x2.46) | Brown-out Detect/Reset，DMA，I2S，LVD，POR，PWM，WDT | 27 | 48MHz | 16K x 8 | 128KB (128K x 8) | - | 1.71 V ~ 3.6 V | A/D 12bit SAR，D/A 12bit | Internal | I2C，LINbus，SPI，UART/USART，USB，USB OTG | ||
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NXP USA Inc. |
5,000
|
3 days |
-
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MOQ: 1 MPQ: 1
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KINETIS KL26: 48MHZ CORTEX-M0+ U
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- | Kinetis KL2 | -40°C ~ 85°C (TA) | 36-UFBGA，WLCSP | 36-WLCSP (2.37x2.46) | Brown-out Detect/Reset，DMA，I2S，LVD，POR，PWM，WDT | 27 | 48MHz | 16K x 8 | 128KB (128K x 8) | - | 1.71 V ~ 3.6 V | A/D 12bit SAR，D/A 12bit | Internal | I2C，LINbus，SPI，UART/USART，USB，USB OTG | ||
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Microchip Technology |
Inquiry
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- |
-
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MOQ: 2000 MPQ: 1
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IC MCU 32BIT 128KB FLASH 32TQFP
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Tape & Reel (TR) | SAM L21E | -40°C ~ 85°C (TA) | 32-TQFP | 32-TQFP (7x7) | DMA，POR，PWM，WDT | 25 | 48MHz | 16K x 8 | 128KB (128K x 8) | - | 1.62 V ~ 3.63 V | A/D 10x12b，D/A 2x12b | Internal | I2C，LINbus，SCI，SPI，UART/USART，USB | ||
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Microchip Technology |
1,999
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 128KB FLASH 32TQFP
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Cut Tape (CT) | SAM L21E | -40°C ~ 85°C (TA) | 32-TQFP | 32-TQFP (7x7) | DMA，POR，PWM，WDT | 25 | 48MHz | 16K x 8 | 128KB (128K x 8) | - | 1.62 V ~ 3.63 V | A/D 10x12b，D/A 2x12b | Internal | I2C，LINbus，SCI，SPI，UART/USART，USB | ||
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Microchip Technology |
1,999
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 128KB FLASH 32TQFP
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- | SAM L21E | -40°C ~ 85°C (TA) | 32-TQFP | 32-TQFP (7x7) | DMA，POR，PWM，WDT | 25 | 48MHz | 16K x 8 | 128KB (128K x 8) | - | 1.62 V ~ 3.63 V | A/D 10x12b，D/A 2x12b | Internal | I2C，LINbus，SCI，SPI，UART/USART，USB | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1500 MPQ: 1
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KINETIS E SERIES 64K FLASH 4K RA
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Tape & Reel (TR) | Kinetis KEA | -40°C ~ 125°C (TA) | 64-LQFP | 64-LQFP (10x10) | LVD，POR，PWM，WDT | 57 | 40MHz | 4K x 8 | 64KB (64K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b | Internal | I2C，LINbus，SPI，UART/USART | ||
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NXP USA Inc. |
1,340
|
3 days |
-
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MOQ: 1 MPQ: 1
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KINETIS E SERIES 64K FLASH 4K RA
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Cut Tape (CT) | Kinetis KEA | -40°C ~ 125°C (TA) | 64-LQFP | 64-LQFP (10x10) | LVD，POR，PWM，WDT | 57 | 40MHz | 4K x 8 | 64KB (64K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b | Internal | I2C，LINbus，SPI，UART/USART | ||
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NXP USA Inc. |
1,340
|
3 days |
-
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MOQ: 1 MPQ: 1
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KINETIS E SERIES 64K FLASH 4K RA
|
- | Kinetis KEA | -40°C ~ 125°C (TA) | 64-LQFP | 64-LQFP (10x10) | LVD，POR，PWM，WDT | 57 | 40MHz | 4K x 8 | 64KB (64K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b | Internal | I2C，LINbus，SPI，UART/USART | ||
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NXP USA Inc. |
418
|
3 days |
-
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MOQ: 1 MPQ: 1
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32-BIT ARM CORTEX-M0+
|
Tray | LPC51U | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | Brown-out Detect/Reset，DMA，I2S，POR，PWM，WDT | 37 | 100MHz | 96K x 8 | 256KB (256K x 8) | - | 1.62 V ~ 3.6 V | A/D 12x12b | Internal | Flexcomm，I2C，SPI，UART/USART，USB | ||
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NXP USA Inc. |
780
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 64KB FLASH 64LQFP
|
Tray | Kinetis KEA | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | LVD，POR，PWM，WDT | 57 | 48MHz | 8K x 8 | 64KB (64K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x12b | Internal | CANbus，I2C，LINbus，SPI，UART/USART | ||
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NXP USA Inc. |
795
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 64LQFP
|
Tray | Kinetis KEA | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | LVD，POR，PWM，WDT | 57 | 48MHz | 8K x 8 | 64KB (64K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x12b | Internal | CANbus，I2C，LINbus，SPI，UART/USART | ||
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NXP USA Inc. |
490
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
KINETIS KL17: 48MHZ CORTEX-M0+ U
|
Tray | Kinetis KL1 | -40°C ~ 105°C (TA) | 36-XFBGA | 36-XFBGA (3.5x3.5) | DMA，I2S，PWM，WDT | 32 | 48MHz | 8K x 8 | 32KB (32K x 8) | - | 1.71 V ~ 3.6 V | A/D 15x16b | Internal | I2C，FlexIO，SPI，UART/USART | ||
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NXP USA Inc. |
741
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
32-BIT ARM CORTEX-M0+
|
Tray | LPC51U | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | Brown-out Detect/Reset，DMA，I2S，POR，PWM，WDT | 48 | 100MHz | 96K x 8 | 256KB (256K x 8) | - | 1.62 V ~ 3.6 V | A/D 12x12b | Internal | Flexcomm，I2C，SPI，UART/USART，USB | ||
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|
|
NXP USA Inc. |
160
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
KINETIS KL13: 48MHZ CORTEX-M0+ U
|
Tray | Kinetis KL0 | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA，PWM，WDT | 54 | 48MHz | 4K x 8 | 32KB (32K x 8) | - | 1.71 V ~ 3.6 V | A/D 20x16b，D/A 1x12b | Internal | FlexIO，I2C，IrDA，SPI，UART/USART | ||
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|
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NXP USA Inc. |
160
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
KINETIS L 32-BIT MCU ARM CORTEX
|
Tray | Kinetis KL3 | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA，LCD，PWM，WDT | 54 | 48MHz | 4K x 8 | 32KB (32K x 8) | - | 1.71 V ~ 3.6 V | A/D 20x16b，D/A 1x12b | Internal | FlexIO，I2C，IrDA，SPI，UART/USART | ||
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|
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NXP USA Inc. |
103
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 32QFN
|
Tray | Kinetis KV | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | DMA，LVD，POR，WDT | 28 | 75MHz | 16K x 8 | 64KB (64K x 8) | - | 1.71 V ~ 3.6 V | A/D 2x16b，D/A 1x12b | Internal | CANbus，I2C，SPI，UART/USART | ||
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|
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NXP USA Inc. |
471
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 32QFN
|
Tray | Kinetis KV | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | DMA，LVD，POR，WDT | 28 | 75MHz | 16K x 8 | 128KB (128K x 8) | - | 1.71 V ~ 3.6 V | A/D 2x16b，D/A 1x12b | Internal | CANbus，I2C，SPI，UART/USART | ||
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|
|
NXP USA Inc. |
444
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MCU 32BIT 64KB FLASH 80LQFP
|
Tray | Kinetis KEA | -40°C ~ 125°C (TA) | 80-LQFP | 80-LQFP (14x14) | LVD，POR，PWM，WDT | 71 | 48MHz | 8K x 8 | 64KB (64K x 8) | - | 2.7 V ~ 5.5 V | - | Internal | CANbus，I2C，LINbus，SPI，UART/USART | ||
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|
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NXP USA Inc. |
250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 48LQFP
|
Tray | LPC11Exx | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | Brown-out Detect/Reset，DMA，POR，PWM，WDT | 36 | 50MHz | 12K x 8 | 64KB (64K x 8) | 4K x 8 | 2.4 V ~ 3.6 V | A/D 8x12b | Internal | I2C，Microwire，SPI，SSI，SSP，UART/USART |
