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Discover 121 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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NXP USA Inc. |
Inquiry
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MOQ: 1300 MPQ: 1
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IC MCU 16BIT 128KB FLASH 48QFN
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Tray | HCS12 | -40°C ~ 105°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 6K x 8 | 128KB (128K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
Inquiry
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MOQ: 1300 MPQ: 1
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IC MCU 8BIT 48KB FLASH 48QFN
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Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 38 | 40MHz | 2K x 8 | 48KB (48K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
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MOQ: 1300 MPQ: 1
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IC MCU 16BIT 32KB FLASH 48QFN
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Tray | HCS12 | -40°C ~ 85°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 2K x 8 | 32KB (32K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
Inquiry
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MOQ: 1300 MPQ: 1
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IC MCU 16BIT 64KB FLASH 48QFN
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Tray | HCS12 | -40°C ~ 85°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 4K x 8 | 64KB (64K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
Inquiry
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MOQ: 1300 MPQ: 1
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IC MCU 16BIT 128KB FLASH 48QFN
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Tray | HCS12 | -40°C ~ 125°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 6K x 8 | 128KB (128K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
Inquiry
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MOQ: 1300 MPQ: 1
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IC MCU 8BIT 64KB FLASH 48QFN
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Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，PWM，WDT | S08 | 38 | 50MHz | 4K x 8 | 64KB (64K x 8) | - | 1.8 V ~ 3.6 V | A/D 10x12b | Internal | I2C，LINbus，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
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MOQ: 1300 MPQ: 1
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IC MCU 8BIT 96KB FLASH 48QFN
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Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，PWM，WDT | S08 | 38 | 50MHz | 6K x 8 | 96KB (96K x 8) | - | 1.8 V ~ 3.6 V | A/D 10x12b | Internal | I2C，LINbus，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
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MOQ: 260 MPQ: 1
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IC MCU 8BIT 8KB FLASH 48QFN
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Tray | S08 | -40°C ~ 125°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 39 | 40MHz | 1K x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
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MOQ: 1300 MPQ: 1
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IC MCU 8BIT 16KB FLASH 48QFN
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Tray | S08 | -40°C ~ 125°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 38 | 40MHz | 1K x 8 | 16KB (16K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
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MOQ: 260 MPQ: 1
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IC MCU 8BIT 60KB FLASH 48QFN
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Tray | S08 | -40°C ~ 125°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 38 | 40MHz | 2K x 8 | 60KB (60K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
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MOQ: 2000 MPQ: 1
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IC MCU 8BIT 32KB FLASH 48QFN
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Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 39 | 40MHz | 2K x 8 | 32KB (32K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
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MOQ: 1300 MPQ: 1
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IC MCU 8BIT 32KB FLASH 48QFN
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Tray | HC08 | 0°C ~ 70°C (TA) | 48-VFQFN Exposed Pad | LED，LVD，POR，PWM | HC08 | 29 | 8MHz | 1K x 8 | 32KB (32K x 8) | - | 3.5 V ~ 5.5 V | - | Internal | SPI，USB | 8-Bit | ||
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NXP USA Inc. |
Inquiry
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MOQ: 260 MPQ: 1
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IC MCU 16BIT 96KB FLASH 48QFN
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Tray | HCS12 | -40°C ~ 125°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 6K x 8 | 96KB (96K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
Inquiry
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-
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MOQ: 260 MPQ: 1
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IC MCU 8BIT 60KB FLASH 48QFN
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Tray | S08 | -40°C ~ 125°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 38 | 40MHz | 2K x 8 | 60KB (60K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1300 MPQ: 1
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IC MCU 8BIT 48KB FLASH 48QFN
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Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 38 | 40MHz | 2K x 8 | 48KB (48K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1300 MPQ: 1
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IC MCU 8BIT 60KB FLASH 48QFN
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Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 39 | 40MHz | 4K x 8 | 60KB (60K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 260 MPQ: 1
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IC MCU 8BIT 16KB FLASH 48QFN
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Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 39 | 40MHz | 1K x 8 | 16KB (16K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 260 MPQ: 1
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IC MCU 8BIT 32KB FLASH 48QFN
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Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 39 | 40MHz | 2K x 8 | 32KB (32K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 260 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 48QFN
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Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 39 | 40MHz | 4K x 8 | 60KB (60K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 780 MPQ: 1
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IC MCU 8BIT 60KB FLASH 48QFN
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Tray | S08 | -40°C ~ 125°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 38 | 40MHz | 2K x 8 | 60KB (60K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit |
