- Packaging：
-
- Operating Temperature：
-
- Package / Case：
-
- Peripherals：
-
- Core Processor：
-
- RAM Size：
-
- Program Memory Size：
-
- EEPROM Size：
-
- Voltage - Supply (Vcc/Vdd)：
-
- Data Converters：
-
- Oscillator Type：
-
- Connectivity：
-
- Core Size：
-
- Selected conditions:
Discover 121 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
|
|
|
NXP USA Inc. |
144
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 48QFN
|
Tray | Kinetis K20 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M4 | 29 | 50MHz | 16K x 8 | 128KB (128K x 8) | - | 1.71 V ~ 3.6 V | A/D 11x16b | Internal | I2C，IrDA，SPI，UART/USART，USB，USB OTG | 32-Bit | ||
|
|
|
NXP USA Inc. |
632
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 128KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，PWM，WDT | S08 | 38 | 50MHz | 8K x 8 | 128KB (128K x 8) | - | 1.8 V ~ 3.6 V | A/D 10x12b | Internal | I2C，LINbus，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
846
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 38 | 40MHz | 1K x 8 | 16KB (16K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
497
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 37 | 48MHz | 4K x 8 | 60KB (60K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x12b | External | I2C，LINbus，SCI，SPI，USB | 8-Bit | ||
|
|
|
NXP USA Inc. |
486
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 38 | 40MHz | 2K x 8 | 32KB (32K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
321
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 38 | 40MHz | 2K x 8 | 60KB (60K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
785
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 48QFN
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 4K x 8 | 64KB (64K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
60
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 48QFN
|
Tray | Kinetis K10 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M4 | 33 | 50MHz | 16K x 8 | 64KB (64K x 8) | - | 1.71 V ~ 3.6 V | A/D 16x16b | Internal | I2C，IrDA，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
47
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 38 | 40MHz | 1K x 8 | 16KB (16K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
12
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 39 | 40MHz | 1K x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
6
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 48QFN
|
Tray | Kinetis K20 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M4 | 29 | 50MHz | 16K x 8 | 128KB (128K x 8) | 2K x 8 | 1.71 V ~ 3.6 V | A/D 11x16b | Internal | I2C，IrDA，SPI，UART/USART，USB，USB OTG | 32-Bit | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48QFN
|
Tape & Reel (TR) | HCS12 | -40°C ~ 105°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 2K x 8 | 32KB (32K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 48QFN
|
Tape & Reel (TR) | HCS12 | -40°C ~ 105°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 6K x 8 | 128KB (128K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
2,000
|
3 days |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 48QFN
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 39 | 40MHz | 2K x 8 | 16KB (16K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 128KB FLASH 48QFN
|
Tape & Reel (TR) | HCS12 | -40°C ~ 125°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 6K x 8 | 128KB (128K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48QFN
|
Tray | HCS12 | -40°C ~ 105°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 2K x 8 | 32KB (32K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 96KB FLASH 48QFN
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 6K x 8 | 96KB (96K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 48QFN
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | HCS12 | 34 | 32MHz | 4K x 8 | 64KB (64K x 8) | 4K x 8 | 1.72 V ~ 5.5 V | A/D 10x12b | Internal | CANbus，SCI，SPI | 16-Bit | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 38 | 40MHz | 2K x 8 | 60KB (60K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48QFN
|
Tape & Reel (TR) | HCS12 | -40°C ~ 85°C (TA) | 48-TFQFN Exposed Pad | LVD，POR，PWM，WDT | 12V1 | 40 | 25MHz | 2K x 8 | 32KB (32K x 8) | 1K x 8 | 3.13 V ~ 5.5 V | A/D 8x10b | Internal | IrDA，LINbus，SCI，SPI | 16-Bit |
