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Discover 121 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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NXP USA Inc. |
4,680
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MCU 8BIT 16KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 39 | 40MHz | 2K x 8 | 16KB (16K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
4,000
|
3 days |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 48QFN
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 39 | 40MHz | 4K x 8 | 60KB (60K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
5,938
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 48QFN
|
Cut Tape (CT) | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 39 | 40MHz | 4K x 8 | 60KB (60K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
5,938
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 60KB FLASH 48QFN
|
- | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 39 | 40MHz | 4K x 8 | 60KB (60K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
1,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 48QFN
|
Tray | Kinetis K10 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M4 | 33 | 50MHz | 8K x 8 | 32KB (32K x 8) | 2K x 8 | 1.71 V ~ 3.6 V | A/D 16x16b | Internal | I2C，IrDA，SPI，UART/USART | 32-Bit | ||
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|
NXP USA Inc. |
278
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 48QFN
|
Tray | Kinetis K10 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M4 | 33 | 50MHz | 16K x 8 | 128KB (128K x 8) | - | 1.71 V ~ 3.6 V | A/D 16x16b | Internal | I2C，IrDA，SPI，UART/USART | 32-Bit | ||
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|
NXP USA Inc. |
1,479
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 38 | 40MHz | 2K x 8 | 32KB (32K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
1,150
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 39 | 40MHz | 2K x 8 | 32KB (32K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
1,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 48QFN
|
Tray | MCF51CN | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，PWM，WDT | Coldfire V1 | 38 | 50MHz | 24K x 8 | 128KB (128K x 8) | - | 1.8 V ~ 3.6 V | A/D 12x12b | External | Ethernet，I2C，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
260
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 48QFN
|
Tray | Kinetis K10 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M4 | 33 | 50MHz | 8K x 8 | 32KB (32K x 8) | - | 1.71 V ~ 3.6 V | A/D 16x16b | Internal | I2C，IrDA，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
260
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 48QFN
|
Tray | Kinetis K20 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M4 | 29 | 50MHz | 8K x 8 | 32KB (32K x 8) | - | 1.71 V ~ 3.6 V | A/D 11x16b | Internal | I2C，IrDA，SPI，UART/USART，USB，USB OTG | 32-Bit | ||
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NXP USA Inc. |
2,877
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，PWM，WDT | S08 | 38 | 50MHz | 1K x 8 | 16KB (16K x 8) | - | 1.8 V ~ 3.6 V | A/D 10x12b | Internal | I2C，LINbus，SCI，SPI | 8-Bit | ||
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|
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NXP USA Inc. |
230
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 48QFN
|
Tray | Kinetis K10 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M4 | 33 | 50MHz | 16K x 8 | 64KB (64K x 8) | 2K x 8 | 1.71 V ~ 3.6 V | A/D 16x16b | Internal | I2C，IrDA，SPI，UART/USART | 32-Bit | ||
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|
|
NXP USA Inc. |
260
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 48QFN
|
Tray | Kinetis K20 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M4 | 29 | 50MHz | 8K x 8 | 32KB (32K x 8) | 2K x 8 | 1.71 V ~ 3.6 V | A/D 11x16b | Internal | I2C，IrDA，SPI，UART/USART，USB，USB OTG | 32-Bit | ||
|
|
|
NXP USA Inc. |
260
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 48QFN
|
Tray | Kinetis K20 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M4 | 29 | 50MHz | 16K x 8 | 64KB (64K x 8) | - | 1.71 V ~ 3.6 V | A/D 11x16b | Internal | I2C，IrDA，SPI，UART/USART，USB，USB OTG | 32-Bit | ||
|
|
|
NXP USA Inc. |
185
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，PWM，WDT | S08 | 38 | 50MHz | 2K x 8 | 32KB (32K x 8) | - | 1.8 V ~ 3.6 V | A/D 10x12b | Internal | I2C，LINbus，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
110
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 48QFN
|
Tray | Kinetis K10 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M4 | 33 | 50MHz | 16K x 8 | 128KB (128K x 8) | 2K x 8 | 1.71 V ~ 3.6 V | A/D 16x16b | Internal | I2C，IrDA，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
260
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 48QFN
|
Tray | Kinetis K20 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | DMA，I2S，LVD，POR，PWM，WDT | ARM Cortex-M4 | 29 | 50MHz | 16K x 8 | 64KB (64K x 8) | 2K x 8 | 1.71 V ~ 3.6 V | A/D 11x16b | Internal | I2C，IrDA，SPI，UART/USART，USB，USB OTG | 32-Bit | ||
|
|
|
NXP USA Inc. |
283
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 32KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 37 | 48MHz | 2K x 8 | 32KB (32K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x12b | External | I2C，LINbus，SCI，SPI，USB | 8-Bit | ||
|
|
|
NXP USA Inc. |
2,569
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 48QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | LVD，POR，PWM，WDT | S08 | 37 | 48MHz | 1K x 8 | 16KB (16K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x12b | External | I2C，LINbus，SCI，SPI，USB | 8-Bit |
