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Discover 56 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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Infineon Technologies |
Inquiry
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 4MB FLASH 416BGA
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Tape & Reel (TR) | TC11xx | -40°C ~ 125°C (TA) | PG-BGA-416-10 | DMA，POR，WDT | TriCore | 219 | 180MHz | 224K x 8 | 4MB (4M x 8) | - | 1.42 V ~ 1.58 V | A/D 48x12b | Internal | ASC，CANbus，EBI/EMI，MLI，MSC，SSC | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 2MB FLASH 416BGA
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Tape & Reel (TR) | MPC55xx Qorivva | -40°C ~ 125°C (TA) | 416-PBGA (27x27) | DMA，POR，PWM，WDT | e200z6 | 256 | 132MHz | 64K x 8 | 2MB (2M x 8) | - | 1.35 V ~ 1.65 V | A/D 40x12b | External | CANbus，EBI/EMI，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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MOQ: 200 MPQ: 1
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IC MCU 32BIT 2MB FLASH 416BGA
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Tray | MPC55xx Qorivva | -40°C ~ 125°C (TA) | 416-PBGA (27x27) | DMA，POR，PWM，WDT | e200z6 | 238 | 132MHz | 80K x 8 | 2MB (2M x 8) | - | 1.35 V ~ 1.65 V | A/D 40x12b | External | CANbus，EBI/EMI，Ethernet，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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MOQ: 200 MPQ: 1
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IC MCU 32BIT 2MB FLASH 416BGA
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Tray | MPC55xx Qorivva | -40°C ~ 125°C (TA) | 416-PBGA (27x27) | DMA，POR，PWM，WDT | e200z6 | 256 | 132MHz | 64K x 8 | 2MB (2M x 8) | - | 1.35 V ~ 1.65 V | A/D 40x12b | External | CANbus，EBI/EMI，SCI，SPI | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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MOQ: 40 MPQ: 1
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IC MCU 32BIT 3MB FLASH 416BGA
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Tray | PX | -40°C ~ 105°C (TA) | 416-PBGA (27x27) | DMA，POR，PWM，WDT | e200z7 | 198 | 264MHz | 192K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 64x12b | Internal | CANbus，EBI/EMI，LINbus，SCI，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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MOQ: 40 MPQ: 1
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IC MCU 32BIT 2MB FLASH 416BGA
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Tray | PX | -40°C ~ 105°C (TA) | 416-PBGA (27x27) | DMA，POR，PWM，WDT | e200z4d | 177 | 125MHz | 64K x 8 | 2MB (2M x 8) | - | 3 V ~ 5.5 V | A/D 20x10b | Internal | CANbus，I2C，LINbus，SCI，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
Inquiry
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MOQ: 40 MPQ: 1
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IC MCU 32BIT 4MB FLASH 416BGA
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Tray | PX | -40°C ~ 105°C (TA) | 416-PBGA (27x27) | DMA，POR，PWM，WDT | e200z7 | 198 | 264MHz | 256K x 8 | 4MB (4M x 8) | - | 3 V ~ 5.5 V | A/D 64x12b | Internal | CANbus，EBI/EMI，LINbus，SCI，SPI，UART/USART | 32-Bit | ||
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Cypress Semiconductor Corp |
Inquiry
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MOQ: 40 MPQ: 1
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IC MCU 32BIT 2MB FLASH 416BGA
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Tray | FR MB91520 | -40°C ~ 105°C (TA) | 416-PBGA (27x27) | DMA，LVD，POR，PWM，WDT | FR81S | 219 | 128MHz | 336K x 8 | 2.0625MB (2.0625M x 8) | 64K x 8 | 2.7 V ~ 5.5 V | A/D 64x12b，D/A 2x8b | External | CANbus，CSIO，EBI/EMI，I2C，LINbus，SPI，UART/USART | 32-Bit | |||
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Cypress Semiconductor Corp |
Inquiry
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MOQ: 40 MPQ: 1
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IC MCU 32BIT 1.5MB FLASH 416BGA
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Tray | FR MB91520 | -40°C ~ 105°C (TA) | 416-PBGA (27x27) | DMA，LVD，POR，PWM，WDT | FR81S | 219 | 128MHz | 208K x 8 | 1.5625MB (1.5625M x 8) | 64K x 8 | 2.7 V ~ 5.5 V | A/D 64x12b，D/A 2x8b | External | CANbus，CSIO，EBI/EMI，I2C，LINbus，SPI，UART/USART | 32-Bit | |||
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NXP USA Inc. |
Inquiry
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MOQ: 200 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tray | MPC56xx Qorivva | -40°C ~ 85°C (TA) | 416-PBGA (27x27) | DMA，POR，PWM，WDT | e200z4d | 177 | 125MHz | 1.064M x 8 | 2MB (2M x 8) | - | 3 V ~ 5.5 V | A/D 20x10b | Internal | CANbus，I2C，LINbus，SCI，SPI | 32-Bit | |||
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NXP USA Inc. |
Inquiry
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-
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MOQ: 200 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tray | MPC55xx Qorivva | -40°C ~ 125°C (TA) | 416-PBGA (27x27) | DMA，POR，PWM，WDT | e200z6 | 256 | 112MHz | 64K x 8 | 2MB (2M x 8) | - | 1.35 V ~ 1.65 V | A/D 40x12b | External | CANbus，EBI/EMI，SCI，SPI | 32-Bit | |||
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NXP USA Inc. |
Inquiry
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-
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MOQ: 200 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tray | MPC55xx Qorivva | -40°C ~ 125°C (TA) | 416-PBGA (27x27) | DMA，POR，PWM，WDT | e200z6 | 256 | 132MHz | 64K x 8 | 2MB (2M x 8) | - | 1.35 V ~ 1.65 V | A/D 40x12b | External | CANbus，EBI/EMI，SCI，SPI | 32-Bit | |||
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NXP USA Inc. |
Inquiry
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-
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MOQ: 200 MPQ: 1
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NXP 32-BIT MCU POWER ARCH CORE
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Tray | MPC55xx Qorivva | -40°C ~ 125°C (TA) | 416-PBGA (27x27) | DMA，POR，PWM，WDT | e200z6 | 238 | 132MHz | 80K x 8 | 2MB (2M x 8) | - | 1.35 V ~ 1.65 V | A/D 40x12b | External | CANbus，EBI/EMI，Ethernet，SCI，SPI | 32-Bit | |||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
NXP 32-BIT MCU POWER ARCH CORE
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Tray | MPC55xx Qorivva | -40°C ~ 125°C (TA) | 416-PBGA (27x27) | DMA，POR，PWM，WDT | e200z6 | 238 | 132MHz | 80K x 8 | 2MB (2M x 8) | - | 1.35 V ~ 1.65 V | A/D 40x12b | External | CANbus，EBI/EMI，Ethernet，SCI，SPI | 32-Bit | |||
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Infineon Technologies |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 3MB FLASH 416BGA
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Tape & Reel (TR) | TC17xx | -40°C ~ 125°C (TA) | PG-BGA-416-10 | DMA，POR，WDT | TriCore | 221 | 150MHz | 224K x 8 | 3MB (3M x 8) | 64K x 8 | 1.42 V ~ 1.58 V | A/D 4x10b，44x12b | External | ASC，CANbus，EBI/EMI，FlexRay，MLI，MSC，SSC | 32-Bit | ||
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|
Infineon Technologies |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 416BGA
|
Tape & Reel (TR) | TC17xx | -40°C ~ 125°C (TA) | PG-BGA-416-10 | DMA，POR，WDT | TriCore | 221 | 150MHz | 224K x 8 | 3MB (3M x 8) | 64K x 8 | 1.42 V ~ 1.58 V | A/D 4x10b，44x12b | External | ASC，CANbus，EBI/EMI，FlexRay，MLI，MSC，SSC | 32-Bit |
