- Series:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Core Processor:
-
- Number of I/O:
-
- Program Memory Size:
-
- Voltage - Supply (Vcc/Vdd):
-
- Data Converters:
-
- Connectivity:
-
- Core Size:
-
- Selected conditions:
Discover 145 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | Core Size | ||
NXP USA Inc. |
346
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 121BGA
|
Tray | Kinetis KL4 | -40°C ~ 105°C (TA) | 121-LFBGA | 121-MAPBGA (8x8) | ARM Cortex-M0+ | 84 | 48MHz | 16K x 8 | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D - 16bit,D/A - 12bit | I2C,LINbus,SPI,UART/USART,USB,USB OTG | 32-Bit | ||||
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 5000 MPQ: 1
|
KINETIS KL26: 48MHZ CORTEX-M0+ U
|
Tape & Reel (TR) | Kinetis KL2 | -40°C ~ 85°C (TA) | 36-UFBGA,WLCSP | 36-WLCSP (2.37x2.46) | ARM Cortex-M0+ | 27 | 48MHz | 16K x 8 | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D 12bit SAR,D/A 12bit | I2C,LINbus,SPI,UART/USART,USB,USB OTG | 32-Bit | ||||
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
KINETIS KL26: 48MHZ CORTEX-M0+ U
|
Cut Tape (CT) | Kinetis KL2 | -40°C ~ 85°C (TA) | 36-UFBGA,WLCSP | 36-WLCSP (2.37x2.46) | ARM Cortex-M0+ | 27 | 48MHz | 16K x 8 | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D 12bit SAR,D/A 12bit | I2C,LINbus,SPI,UART/USART,USB,USB OTG | 32-Bit | ||||
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
KINETIS KL26: 48MHZ CORTEX-M0+ U
|
- | Kinetis KL2 | -40°C ~ 85°C (TA) | 36-UFBGA,WLCSP | 36-WLCSP (2.37x2.46) | ARM Cortex-M0+ | 27 | 48MHz | 16K x 8 | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D 12bit SAR,D/A 12bit | I2C,LINbus,SPI,UART/USART,USB,USB OTG | 32-Bit | ||||
NXP USA Inc. |
260
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 48QFN
|
Tray | Kinetis KS22 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | 48-QFN (7x7) | ARM Cortex-M4 | 35 | 120MHz | 64K x 8 | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D 1x16b. D/A 1x12b | CANbus,I2C,SPI,UART/USART,USB OTG | 32-Bit | ||||
NXP USA Inc. |
160
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
KINETIS S 32-BIT MCU ARM CORTEX
|
Tray | Kinetis KS22 | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | ARM Cortex-M4 | 40 | 120MHz | 64K x 8 | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D 1x16b. D/A 1x12b | CANbus,I2C,SPI,UART/USART,USB OTG | 32-Bit | ||||
NXP USA Inc. |
640
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
KINETIS KL46: 48MHZ CORTEX-M0+ U
|
Tray | Kinetis KL4 | -40°C ~ 105°C (TA) | 64-LFBGA | 64-MAPBGA (5x5) | ARM Cortex-M0+ | 50 | 48MHz | 32K x 8 | 256KB (256K x 8) | 1.71 V ~ 3.6 V | A/D 16x16b,D/A 1x12b | I2C,LINbus,SPI,UART/USART,USB,USB OTG | 32-Bit | ||||
NXP USA Inc. |
260
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 48QFN
|
Tray | Kinetis KS22 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | 48-QFN (7x7) | ARM Cortex-M4 | 35 | 120MHz | 64K x 8 | 256KB (256K x 8) | 1.71 V ~ 3.6 V | A/D 1x16b. D/A 1x12b | CANbus,I2C,SPI,UART/USART,USB OTG | 32-Bit | ||||
NXP USA Inc. |
160
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
KINETIS S 32-BIT MCU ARM CORTEX
|
Tray | Kinetis KS22 | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | ARM Cortex-M4 | 40 | 120MHz | 64K x 8 | 256KB (256K x 8) | 1.71 V ~ 3.6 V | A/D 1x16b. D/A 1x12b | CANbus,I2C,SPI,UART/USART,USB OTG | 32-Bit | ||||
NXP USA Inc. |
99
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 64LQFP
|
Tray | Kinetis KL1 | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | ARM Cortex-M0+ | 54 | 48MHz | 8K x 8 | 64KB (64K x 8) | 1.71 V ~ 3.6 V | A/D - 16bit,D/A - 12bit | I2C,LINbus,SPI,TSI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
255
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 48QFN
|
Tray | Kinetis KL2 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | 48-QFN (7x7) | ARM Cortex-M0+ | 36 | 48MHz | 4K x 8 | 32KB (32K x 8) | 1.71 V ~ 3.6 V | A/D - 16bit,D/A - 12bit | I2C,LINbus,SPI,UART/USART,USB,USB OTG | 32-Bit | ||||
NXP USA Inc. |
88
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64LQFP
|
Tray | Kinetis KL4 | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | ARM Cortex-M0+ | 50 | 48MHz | 16K x 8 | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D - 16bit,D/A - 12bit | I2C,LINbus,SPI,UART/USART,USB,USB OTG | 32-Bit | ||||
NXP USA Inc. |
74
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 121BGA
|
Tray | Kinetis KL2 | -40°C ~ 105°C (TA) | 121-LFBGA | 121-MAPBGA (8x8) | ARM Cortex-M0+ | 80 | 48MHz | 32K x 8 | 256KB (256K x 8) | 1.71 V ~ 3.6 V | A/D - 16bit,D/A - 12bit | I2C,LINbus,SPI,UART/USART,USB,USB OTG | 32-Bit | ||||
NXP USA Inc. |
90
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
KINETIS S 32-BIT MCU ARM CORTEX
|
Tray | Kinetis KS22 | -40°C ~ 105°C (TA) | 100-LQFP | 100-LQFP (14x14) | ARM Cortex-M4 | 66 | 120MHz | 64K x 8 | 256KB (256K x 8) | 1.71 V ~ 3.6 V | A/D 1x16b. D/A 1x12b | CANbus,I2C,SPI,UART/USART,USB OTG | 32-Bit | ||||
NXP USA Inc. |
8
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 48QFN
|
Tray | Kinetis KL1 | -40°C ~ 105°C (TA) | 48-VFQFN Exposed Pad | 48-QFN (7x7) | ARM Cortex-M0+ | 40 | 48MHz | 4K x 8 | 32KB (32K x 8) | 1.71 V ~ 3.6 V | A/D - 16bit,D/A - 12bit | I2C,LINbus,SPI,TSI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 64LQFP
|
Tray | Kinetis KL1 | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | ARM Cortex-M0+ | 54 | 48MHz | 4K x 8 | 32KB (32K x 8) | 1.71 V ~ 3.6 V | A/D - 16bit,D/A - 12bit | I2C,LINbus,SPI,TSI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
3
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 64LQFP
|
Tray | Kinetis KL2 | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | ARM Cortex-M0+ | 50 | 48MHz | 4K x 8 | 32KB (32K x 8) | 1.71 V ~ 3.6 V | A/D - 16bit,D/A - 12bit | I2C,LINbus,SPI,UART/USART,USB,USB OTG | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 5000 MPQ: 1
|
KINETIS KL16: 48MHZ CORTEX-M0+ U
|
Tape & Reel (TR) | Kinetis KL1 | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | ARM Cortex-M0+ | 28 | 48MHz | 8K x 8 | 64KB (64K x 8) | 1.71 V ~ 3.6 V | A/D - 16bit,D/A - 12bit | I2C,LINbus,SPI,TSI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64LQFP
|
Tape & Reel (TR) | Kinetis KL1 | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | ARM Cortex-M0+ | 54 | 48MHz | 16K x 8 | 128KB (128K x 8) | 1.71 V ~ 3.6 V | A/D - 16bit,D/A - 12bit | I2C,LINbus,SPI,TSI,UART/USART | 32-Bit | ||||
STMicroelectronics |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 64LQFP
|
Tape & Reel (TR) | STM32F4 | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | ARM Cortex-M4 | 50 | 180MHz | 128K x 8 | 256KB (256K x 8) | 1.7 V ~ 3.6 V | A/D 16x12b,D/A 2x12b | CANbus,EBI/EMI,I2C,IrDA,LINbus,SAI,SD,SPDIF-Rx,SPI,UART/USART,USB,USB OTG | 32-Bit |