- Manufacturer:
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- Series:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Core Processor:
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- Number of I/O:
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- RAM Size:
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- Program Memory Size:
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- EEPROM Size:
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- Voltage - Supply (Vcc/Vdd):
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- Data Converters:
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- Oscillator Type:
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Discover 227 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | ||
NXP USA Inc. |
90
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 100LQFP
|
Tray | MCF51MM | -40°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | Coldfire V1 | 65 | 50MHz | 32K x 8 | 256KB (256K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x16b,D/A 1x12b | External | CANbus,EBI/EMI,I2C,SCI,SPI,USB OTG | 32-Bit | ||||
NXP USA Inc. |
5
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 44LQFP
|
Tray | Kinetis KE02 | -40°C ~ 105°C (TA) | 44-LQFP | 44-LQFP (10x10) | ARM Cortex-M0+ | 37 | 40MHz | 4K x 8 | 64KB (64K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b,D/A 2x6b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
1
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64QFP
|
Tray | Kinetis KE06 | -40°C ~ 105°C (TA) | 64-QFP | 64-QFP (14x14) | ARM Cortex-M0+ | 58 | 48MHz | 16K x 8 | 128KB (128K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x12b,D/A 2x6b | Internal | CANbus,I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
7
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 64LQFP
|
Tray | MCF51QE | 0°C ~ 70°C (TA) | 64-LQFP | 64-LQFP (10x10) | Coldfire V1 | 54 | 50MHz | 8K x 8 | 32KB (32K x 8) | - | 1.8 V ~ 3.6 V | A/D 20x12b | Internal | I2C,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
24
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 80LQFP
|
Tray | MCF51AC | -40°C ~ 85°C (TA) | 80-LQFP | 80-LQFP (14x14) | Coldfire V1 | 69 | 50MHz | 32K x 8 | 256KB (256K x 8) | - | 2.7 V ~ 5.5 V | A/D 24x12b | External | I2C,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 5000 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16TSSOP
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | S08 | 12 | 20MHz | 512 x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x12b | External | LINbus,SCI | 8-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8-BIT S08QL 20-TSSOP
|
Tube | S08 | -40°C ~ 85°C (TA) | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | S08 | 18 | 20MHz | 256 x 8 | 4KB (4K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x12b | Internal | LINbus,SCI | 8-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8-BIT S08QL 16-TSSOP
|
Tube | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | S08 | 14 | 20MHz | 256 x 8 | 4KB (4K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x12b | Internal | LINbus,SCI | 8-Bit | ||||
NXP USA Inc. |
1,500
|
3 days |
-
|
MOQ: 1500 MPQ: 1
|
KINETIS KE02: 40MHZ CORTEX-M0+ 5
|
Tape & Reel (TR) | Kinetis KE02 | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | ARM Cortex-M0+ | 57 | 40MHz | 4K x 8 | 64KB (64K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b,D/A 2x6b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8-BIT S08QL 20-TSSOP
|
Tube | S08 | -40°C ~ 85°C (TA) | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | S08 | 18 | 20MHz | 8K x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x12b | Internal | LINbus,SCI | 8-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64LQFP
|
Tape & Reel (TR) | MCF51JM | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | Coldfire V1 | 51 | 50MHz | 16K x 8 | 128KB (128K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x12b | External | CANbus,I2C,SCI,SPI,USB OTG | 32-Bit | ||||
Renesas Electronics America |
Inquiry
|
- |
-
|
MOQ: 270 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64LQFP
|
Tray | V850ES/Ix2 | -40°C ~ 85°C (TA) | 64-LQFP | - | V850ES | 39 | 20MHz | 6K x 8 | 128KB (128K x 8) | - | 3.5 V ~ 5.5 V | A/D 8x10b | External | CSI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 256KB FLASH 64LQFP
|
Tray | MCF51AC | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | Coldfire V1 | 54 | 50MHz | 32K x 8 | 256KB (256K x 8) | - | 2.7 V ~ 5.5 V | A/D 20x12b | External | I2C,SCI,SPI | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 5000 MPQ: 1
|
KINETIS KE04: 48MHZ CORTEX-M0+ 5
|
Tape & Reel (TR) | Kinetis KE04 | -40°C ~ 105°C (TA) | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | ARM Cortex-M0+ | 14 | 48MHz | 1K x 8 | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | A/D 6x12b,D/A 2x6b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 5000 MPQ: 1
|
KINETIS KE04: 48MHZ CORTEX-M0+ 5
|
Tape & Reel (TR) | Kinetis KE04 | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | ARM Cortex-M0+ | 22 | 48MHz | 1K x 8 | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | A/D 12x12b,D/A 2x6b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
KINETIS KE04: 48MHZ CORTEX-M0+ 5
|
Tape & Reel (TR) | Kinetis KE04 | -40°C ~ 105°C (TA) | 20-SOIC (0.295",7.50mm Width) | 20-SOIC | ARM Cortex-M0+ | 18 | 48MHz | 1K x 8 | 8KB (8K x 8) | - | 2.7 V ~ 5.5 V | A/D 10x12b,D/A 2x6b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
KINETIS KE02: 20MHZ CORTEX-M0+ 5
|
Tape & Reel (TR) | Kinetis KE02 | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | ARM Cortex-M0+ | 28 | 20MHz | 2K x 8 | 16KB (16K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b,D/A 2x6b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
S08FL 8-BIT MCU S08 CORE 8KB F
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 32-LQFP | 32-LQFP (7x7) | S08 | 30 | 20MHz | 768 x 8 | 8KB (8K x 8) | - | 4.5 V ~ 5.5 V | A/D 12x8b | Internal | SCI | 8-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 5000 MPQ: 1
|
KINETIS KE02: 40MHZ CORTEX-M0+ 5
|
Tape & Reel (TR) | Kinetis KE02 | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-QFN (5x5) | ARM Cortex-M0+ | 28 | 40MHz | 4K x 8 | 32KB (32K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b,D/A 2x6b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
KINETIS KE02: 20MHZ CORTEX-M0+ 5
|
Tape & Reel (TR) | Kinetis KE02 | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | ARM Cortex-M0+ | 28 | 20MHz | 4K x 8 | 32KB (32K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b,D/A 2x6b | Internal | I2C,SPI,UART/USART | 32-Bit |