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Discover 227 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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NXP USA Inc. |
266
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 8KB FLASH 16TSSOP
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Tube | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | S08 | 12 | 20MHz | 512 x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x12b | External | LINbus，SCI | 8-Bit | ||
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NXP USA Inc. |
762
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 32KB FLASH 44LQFP
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Tray | Kinetis KE02 | -40°C ~ 105°C (TA) | 44-LQFP | 44-LQFP (10x10) | ARM Cortex-M0+ | 37 | 40MHz | 4K x 8 | 32KB (32K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
514
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 32KB FLASH 32LQFP
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Tray | Kinetis KE02 | -40°C ~ 105°C (TA) | 32-LQFP | 32-LQFP (7x7) | ARM Cortex-M0+ | 28 | 20MHz | 4K x 8 | 32KB (32K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
132
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 32KB FLASH 64LQFP
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Tray | Kinetis KE02 | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | ARM Cortex-M0+ | 57 | 40MHz | 4K x 8 | 32KB (32K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
484
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 44LQFP
|
Tray | Kinetis KE02 | -40°C ~ 105°C (TA) | 44-LQFP | 44-LQFP (10x10) | ARM Cortex-M0+ | 37 | 20MHz | 4K x 8 | 64KB (64K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
88
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 64KB FLASH 64QFP
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Tray | Kinetis KE02 | -40°C ~ 105°C (TA) | 64-QFP | 64-QFP (14x14) | ARM Cortex-M0+ | 57 | 20MHz | 4K x 8 | 64KB (64K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
92
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 64LQFP
|
Tray | Kinetis KE06 | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | ARM Cortex-M0+ | 58 | 48MHz | 8K x 8 | 64KB (64K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | Internal | CANbus，I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
90
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 80LQFP
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Tray | Kinetis KE04 | -40°C ~ 105°C (TA) | 80-LQFP | 80-LQFP (14x14) | ARM Cortex-M0+ | 71 | 48MHz | 16K x 8 | 128KB (128K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
75
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 32KB FLASH 28SOIC
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Tube | S08 | -40°C ~ 85°C (TA) | 28-SOIC (0.295"，7.50mm Width) | 28-SOIC | S08 | 22 | 50MHz | 2K x 8 | 32KB (32K x 8) | - | 1.8 V ~ 3.6 V | A/D 10x12b | Internal | I2C，LINbus，SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
40
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 8KB FLASH 24QFN
|
Tray | S08 | -40°C ~ 85°C (TA) | 24-VQFN Exposed Pad | 24-QFN-EP (5x5) | S08 | 18 | 20MHz | 512 x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x12b | External | LINbus，SCI | 8-Bit | ||
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NXP USA Inc. |
125
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 44LQFP
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Tray | Kinetis KE02 | -40°C ~ 105°C (TA) | 44-LQFP | 44-LQFP (10x10) | ARM Cortex-M0+ | 37 | 20MHz | 4K x 8 | 32KB (32K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
61
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 64QFP
|
Tray | Kinetis KE04 | -40°C ~ 105°C (TA) | 64-QFP | 64-QFP (14x14) | ARM Cortex-M0+ | 58 | 48MHz | 8K x 8 | 64KB (64K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
58
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 80LQFP
|
Tray | Kinetis KE04 | -40°C ~ 105°C (TA) | 80-LQFP | 80-LQFP (14x14) | ARM Cortex-M0+ | 71 | 48MHz | 8K x 8 | 64KB (64K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
84
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 64LQFP
|
Tray | Kinetis KE06 | -40°C ~ 105°C (TA) | 64-QFP | 64-QFP (14x14) | ARM Cortex-M0+ | 58 | 48MHz | 8K x 8 | 64KB (64K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | Internal | CANbus，I2C，SPI，UART/USART | 32-Bit | ||
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NXP USA Inc. |
48
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB FLASH 64QFP
|
Tray | Kinetis KE04 | -40°C ~ 105°C (TA) | 64-QFP | 64-QFP (14x14) | ARM Cortex-M0+ | 58 | 48MHz | 16K x 8 | 128KB (128K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit | ||
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|
|
NXP USA Inc. |
27
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 64KB FLASH 80LQFP
|
Tray | Kinetis KE06 | -40°C ~ 105°C (TA) | 80-LQFP | 80-LQFP (14x14) | ARM Cortex-M0+ | 71 | 48MHz | 8K x 8 | 64KB (64K x 8) | - | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | Internal | CANbus，I2C，SPI，UART/USART | 32-Bit | ||
|
|
|
NXP USA Inc. |
39
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 44LQFP
|
Tray | MCF51JM | -40°C ~ 105°C (TA) | 44-LQFP | 44-LQFP (10x10) | Coldfire V1 | 33 | 50MHz | 16K x 8 | 32KB (32K x 8) | - | 2.7 V ~ 5.5 V | A/D 8x12b | External | I2C，SCI，SPI，USB OTG | 32-Bit | ||
|
|
|
NXP USA Inc. |
480
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8-BIT S08QL 16-TSSOP
|
Tube | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | S08 | 14 | 20MHz | 8K x 8 | 8KB (8K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x12b | Internal | LINbus，SCI | 8-Bit | ||
|
|
|
NXP USA Inc. |
38
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 4KB FLASH 20SOIC
|
Tube | S08 | -40°C ~ 85°C (TA) | 20-SOIC (0.295"，7.50mm Width) | 20-SOIC | S08 | 16 | 20MHz | 256 x 8 | 4KB (4K x 8) | - | 1.8 V ~ 3.6 V | A/D 8x12b | Internal | I2C，LINbus，SCI，SPI | 8-Bit | ||
|
|
|
NXP USA Inc. |
84
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 64QFP
|
Tray | Kinetis KE02 | -40°C ~ 105°C (TA) | 64-QFP | 64-QFP (14x14) | ARM Cortex-M0+ | 57 | 20MHz | 4K x 8 | 32KB (32K x 8) | 256 x 8 | 2.7 V ~ 5.5 V | A/D 16x12b，D/A 2x6b | Internal | I2C，SPI，UART/USART | 32-Bit |
