BU080Z-178-HT

Description :
CONN IC DIP SOCKET 8POS GOLD
Contact Finish - Mating :
Gold
Contact Finish - Post :
Copper
Contact Finish Thickness - Mating :
78.7μin (2.00μm)
Contact Finish Thickness - Post :
Flash
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass
Features :
Open Frame
Housing Material :
Polybutylene Terephthalate (PBT),Glass Filled
Mounting Type :
Surface Mount
Number of Positions or Pins (Grid) :
8 (2 x 4)
Operating Temperature :
-55°C ~ 125°C
Packaging :
Tube
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
BU-178HT
Termination :
Solder
Type :
DIP,0.3" (7.62mm) Row Spacing
倍数 :
1

Similar products