NXP USA Inc.

SPC5775EDK3MME3

Description :
POWER ARCH CORES 8MB FL
Package :
416-MAPBGA (27x27)
Connectivity :
CANbus,EBI/EMI,Ethernet,FlexCANbus,LINbus,SCI,SPI
Core Processor :
e200z7
Core Size :
32-Bit Dual-Core
Data Converters :
A/D 40x12b eQADCx2
EEPROM Size :
-
Number of I/O :
293
Operating Temperature :
-40°C ~ 125°C (TA)
Oscillator Type :
External
Package / Case :
416-BGA
Packaging :
Tray
Peripherals :
DMA,LVD,POR,Zipwire
Program Memory Size :
4MB (4M x 8)
Program Memory Type :
Flash
RAM Size :
512K x 8
Series :
MPC57xx
Speed :
264MHz
Supplier Device Package :
416-MAPBGA (27x27)
Voltage - Supply (Vcc/Vdd) :
3 V ~ 5.5 V

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