The image is only a reference
BDN13-3CB/A01
- Description :
- HEATSINK CPU W/ADHESIVE 1.31"SQ
- This part is RoHS compliant
- Datasheet (1)
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- Attachment Method :
- Thermal Tape, Adhesive (Included)
- Diameter :
- -
- Height Off Base (Height of Fin) :
- 0.355" (9.02mm)
- Length :
- 1.310" (33.27mm)
- Material :
- Aluminum
- Material Finish :
- Black Anodized
- Package Cooled :
- Assorted (BGA, LGA, CPU, ASIC...)
- Power Dissipation @ Temperature Rise :
- -
- Series :
- BDN
- Shape :
- Square, Pin Fins
- Thermal Resistance @ Forced Air Flow :
- 6.00°C/W @ 400 LFM
- Thermal Resistance @ Natural :
- 16.10°C/W
- Type :
- Top Mount
- Width :
- 1.310" (33.27mm)
