APF19-19-13CB

Attachment Method :

Thermal Tape, Adhesive (Not Included)

Diameter :

-

Height Off Base (Height of Fin) :

0.500" (12.70mm)

Length :

0.748" (19.00mm)

Material :

Aluminum

Material Finish :

Black Anodized

Package Cooled :

Assorted (BGA, LGA, CPU, ASIC...)

Power Dissipation @ Temperature Rise :

-

Series :

APF

Shape :

Square, Fins

Thermal Resistance @ Forced Air Flow :

4.00°C/W @ 200 LFM

Thermal Resistance @ Natural :

-

Type :

Top Mount

Width :

0.748" (19.00mm)