573100D00010G

Attachment Method :

SMD Pad

Diameter :

-

Height Off Base (Height of Fin) :

0.400" (10.16mm)

Length :

0.315" (8.00mm)

Material :

Copper

Material Finish :

Tin

Package Cooled :

TO-252 (DPAK)

Power Dissipation @ Temperature Rise :

0.8W @ 30°C

Series :

-

Shape :

Rectangular, Fins

Thermal Resistance @ Forced Air Flow :

12.50°C/W @ 600 LFM

Thermal Resistance @ Natural :

15.00°C/W

Type :

Top Mount

Width :

0.900" (22.86mm)