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Discover 19 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Height | Length | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Height | Length | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
97
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 27.69MMX406.4MM
|
- | 121°C | 0.250" (6.35mm) | 16.000" (406.40mm) | - | - | Hardware,Rivet,Solder | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
Large Enclosure | 121°C | 0.250" (6.35mm) | 25.000 (7.62m) | - | - | Hardware,Rivet,Solder | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL BF USF
|
Large Enclosure | 121°C | 0.250" (6.35mm) | 25.000 (7.60m) | Unplated | - | Adhesive | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,SNB,USFT
|
- | 121°C | 0.260" (6.60mm) | 16.000" (406.40mm) | Tin | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL SNB
|
Large Enclosure | 121°C | 0.250" (6.35mm) | 25.000 (7.60m) | Tin | 299.21μin (7.60μm) | Hardware,Rivet,Solder | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL NIE
|
Large Enclosure | 121°C | 0.250" (6.35mm) | 25.000 (7.60m) | Nickel | 299.21μin (7.60μm) | Hardware,Rivet,Solder | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL NIB
|
Large Enclosure | 121°C | 0.250" (6.35mm) | 25.000 (7.60m) | Nickel | 299.21μin (7.60μm) | Hardware,Rivet,Solder | ||||
Leader Tech Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | 0.250" (6.35mm) | 24.000" (609.60mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 NI 24--FOLDED SERIES
|
- | -55°C ~ 121°C | 0.250" (6.35mm) | 24.000" (609.60mm) | Nickel | Flash | Adhesive | ||||
Leader Tech Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 070 BD 16--25-109C
|
- | -55°C ~ 121°C | 0.250" (6.35mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 120 BD 16--25-109C
|
- | -55°C ~ 121°C | 0.250" (6.35mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 130 BD 16--25-109C
|
- | -55°C ~ 121°C | 0.250" (6.35mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 SN 24--FOLDED SERIES
|
- | -55°C ~ 121°C | 0.250" (6.35mm) | 24.000" (609.60mm) | Tin | Flash | Adhesive | ||||
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL ZNY
|
Large Enclosure | 121°C | 0.250" (6.35mm) | 25.000 (7.62m) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Hardware,Rivet,Solder | ||||
Leader Tech Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 120 NI 16--25-109C
|
- | -55°C ~ 121°C | 0.250" (6.35mm) | 16.000" (406.40mm) | Nickel | Flash | Adhesive | ||||
Leader Tech Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 130 SN 16--25-109C
|
- | -55°C ~ 121°C | 0.250" (6.35mm) | 16.000" (406.40mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 SU 300"--FOLDED SERI
|
- | -55°C ~ 121°C | 0.250" (6.35mm) | 25.00 (7.62m) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 SN 300"--FOLDED SERI
|
- | -55°C ~ 121°C | 0.250" (6.35mm) | 25.00 (7.62m) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 BD 300"--FOLDED SERI
|
- | -55°C ~ 121°C | 0.250" (6.35mm) | 25.00 (7.62m) | Unplated | - | Adhesive |