Discover 37 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Operating Temperature Type Material Shape Height Length Plating Plating - Thickness Attachment Method
97013502
Laird Technologies EMI
328
3 days
-
MOQ: 1  MPQ: 1
FINGERSTOCK BECU 7.11X406.4MM
- - - - - 16.000" (406.40mm) - - -
97054002
Laird Technologies EMI
102
3 days
-
MOQ: 1  MPQ: 1
GASKET BECU 7.11X406.4MM
121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) - - Adhesive
SG252280C-48
Leader Tech Inc.
76
3 days
-
MOQ: 1  MPQ: 1
FSG,.252"H X .280"W X 48"L
- Fabric Over Foam - C-Fold 0.252" (6.40mm) 48.000" (121.90cm) - - -
97052702
Laird Technologies EMI
Inquiry
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-
MOQ: 1  MPQ: 1
GASKET BECU 7.11X406.4MM
121°C Fingerstock Beryllium Copper - 0.055" (1.40mm) 16.000" (406.40mm) - - Adhesive
97054017
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
GASKET BECU 7.11X406.4MM
121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) Tin 299.21μin (7.60μm) Adhesive
0C97054002
Laird Technologies EMI
Inquiry
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-
MOQ: 1  MPQ: 1
RFI EMI GROUNDING MATERIAL 25FT
121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) Unplated - Adhesive
0C97054017
Laird Technologies EMI
Inquiry
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-
MOQ: 1  MPQ: 1
RFI EMI GROUNDING MATERIAL 25FT
121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) Tin 299.21μin (7.60μm) Adhesive
0C97054019
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
RFI EMI GROUNDING MATERIAL 25FT
121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) Nickel 299.21μin (7.60μm) Adhesive
97054001
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
AP,STR,BF
121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) - - Adhesive
97054009
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
AP,STR,NID,PSA
121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) Nickel 299.21μin (7.60μm) Adhesive
97054015
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
AP,STR,ZNC,PSA
121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) Zinc + Clear Chromate 299.21μin (7.60μm) Adhesive
97054016
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
AP,STR,ZNY,PSA
121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) Zinc + Yellow Chromate 299.21μin (7.60μm) Adhesive
97054018
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
AP,STR,NIE,PSA
121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) Nickel 299.21μin (7.60μm) Adhesive
97054019
Laird Technologies EMI
Inquiry
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-
MOQ: 1  MPQ: 1
AP,STR,NIB,PSA
121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) Nickel 299.21μin (7.60μm) Adhesive
97052717
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
AP,STR,SNB,PSA
121°C Fingerstock Beryllium Copper - 0.055" (1.40mm) 16.000" (406.40mm) Tin 299.21μin (7.60μm) Adhesive
97054021
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
AP,STR,SU,PSA
121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) - - Adhesive
SG060280R-23.62
Leader Tech Inc.
10
3 days
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MOQ: 1  MPQ: 1
EMI FABRIC GASKET 1.52X7.11MM
-40°C ~ 70°C Fabric Over Foam Polyurethane Foam,Nickel-Copper Ripstop (NI/CU) Rectangular 0.060" (1.52mm) 23.62" (599.95mm) - - Non-Conductive Adhesive
11-28RH-BD-16
Leader Tech Inc.
Inquiry
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MOQ: 1  MPQ: 1
0.11 X 0.28 BD 16--11-28RH-BD-16
-55°C ~ 121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) Unplated - Adhesive
11-S-28RH-BD-16
Leader Tech Inc.
Inquiry
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MOQ: 1  MPQ: 1
0.11 X 0.28 BD 16--11-S-28RH-BD-
-55°C ~ 121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) Unplated - Adhesive
SG060280R-48
Leader Tech Inc.
Inquiry
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MOQ: 1  MPQ: 1
.060"H X .280"W X 48"L--RECTANGU
-40°C ~ 70°C Fabric Over Foam Polyurethane Foam,Nickel-Copper Polyester (NI/CU) Rectangular 0.060" (1.52mm) 4.00 (1.22m) - - -