Discover 36 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Operating Temperature Type Material Height Plating Plating - Thickness Attachment Method
97013502
Laird Technologies EMI
328
3 days
-
MOQ: 1  MPQ: 1
FINGERSTOCK BECU 7.11X406.4MM
- - - - - - - -
97054002
Laird Technologies EMI
102
3 days
-
MOQ: 1  MPQ: 1
GASKET BECU 7.11X406.4MM
- 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) - - Adhesive
97052702
Laird Technologies EMI
Inquiry
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-
MOQ: 1  MPQ: 1
GASKET BECU 7.11X406.4MM
- 121°C Fingerstock Beryllium Copper 0.055" (1.40mm) - - Adhesive
97054017
Laird Technologies EMI
Inquiry
-
-
MOQ: 1  MPQ: 1
GASKET BECU 7.11X406.4MM
- 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) Tin 299.21μin (7.60μm) Adhesive
0C97054002
Laird Technologies EMI
Inquiry
-
-
MOQ: 1  MPQ: 1
RFI EMI GROUNDING MATERIAL 25FT
- 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) Unplated - Adhesive
0C97054017
Laird Technologies EMI
Inquiry
-
-
MOQ: 1  MPQ: 1
RFI EMI GROUNDING MATERIAL 25FT
- 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) Tin 299.21μin (7.60μm) Adhesive
0C97054019
Laird Technologies EMI
Inquiry
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-
MOQ: 1  MPQ: 1
RFI EMI GROUNDING MATERIAL 25FT
- 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) Nickel 299.21μin (7.60μm) Adhesive
0C97054001
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
AP COIL BF
All-Purpose 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) - - Adhesive
97054001
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
AP,STR,BF
- 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) - - Adhesive
97054009
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
AP,STR,NID,PSA
- 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) Nickel 299.21μin (7.60μm) Adhesive
97054015
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
AP,STR,ZNC,PSA
- 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) Zinc + Clear Chromate 299.21μin (7.60μm) Adhesive
97054016
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
AP,STR,ZNY,PSA
- 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) Zinc + Yellow Chromate 299.21μin (7.60μm) Adhesive
97054018
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
AP,STR,NIE,PSA
- 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) Nickel 299.21μin (7.60μm) Adhesive
97054019
Laird Technologies EMI
Inquiry
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-
MOQ: 1  MPQ: 1
AP,STR,NIB,PSA
- 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) Nickel 299.21μin (7.60μm) Adhesive
97052717
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
AP,STR,SNB,PSA
- 121°C Fingerstock Beryllium Copper 0.055" (1.40mm) Tin 299.21μin (7.60μm) Adhesive
97054021
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
AP,STR,SU,PSA
- 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) - - Adhesive
0C98054002
Laird Technologies EMI
Inquiry
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MOQ: 1  MPQ: 1
AP COIL BF USFT PSA
All-Purpose 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) Unplated - Adhesive
11-28RH-BD-16
Leader Tech Inc.
Inquiry
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MOQ: 1  MPQ: 1
0.11 X 0.28 BD 16--11-28RH-BD-16
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) Unplated - Adhesive
11-S-28RH-BD-16
Leader Tech Inc.
Inquiry
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MOQ: 1  MPQ: 1
0.11 X 0.28 BD 16--11-S-28RH-BD-
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) Unplated - Adhesive
11-28FSV23-NI-16
Leader Tech Inc.
Inquiry
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MOQ: 1  MPQ: 1
0.11 X 0.28 X 0.23 NI 16--FOLDED
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) Nickel Flash Adhesive