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Discover 10 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Plating | Attachment Method | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Plating | Attachment Method | |
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Laird Technologies EMI |
97
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3 days |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 27.69MMX406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 16.000" (406.40mm) | - | Hardware，Rivet，Solder | ||
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Laird Technologies EMI |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
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Large Enclosure | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 25.000 (7.62m) | - | Hardware，Rivet，Solder | ||
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Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
CSTR COIL BF USF
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Large Enclosure | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 25.000 (7.60m) | Unplated | Adhesive | ||
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Leader Tech Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 1.09 BD 24--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 24.000" (609.60mm) | Unplated | Adhesive | |||
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Laird Technologies EMI |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
AP PCS SNSAT CTL
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- | - | - | - | - | - | - | - | |||
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Leader Tech Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 070 BD 16--25-109C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 16.000" (406.40mm) | Unplated | Adhesive | |||
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Leader Tech Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 120 BD 16--25-109C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 16.000" (406.40mm) | Unplated | Adhesive | |||
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Leader Tech Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 130 BD 16--25-109C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 16.000" (406.40mm) | Unplated | Adhesive | |||
|
|
Leader Tech Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 SU 300"--FOLDED SERI
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 25.00 (7.62m) | Unplated | Adhesive | |||
|
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Leader Tech Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 BD 300"--FOLDED SERI
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 25.00 (7.62m) | Unplated | Adhesive |
