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- Plating - Thickness：
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- Attachment Method：
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Discover 8 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Height | Length | Plating | Plating - Thickness | Attachment Method | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Height | Length | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
97
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3 days |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 27.69MMX406.4MM
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- | 0.250" (6.35mm) | 16.000" (406.40mm) | - | - | Hardware，Rivet，Solder | ||
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Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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Large Enclosure | 0.250" (6.35mm) | 25.000 (7.62m) | - | - | Hardware，Rivet，Solder | ||
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Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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CSTR COIL BF USF
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Large Enclosure | 0.250" (6.35mm) | 25.000 (7.60m) | Unplated | - | Adhesive | ||
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Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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CLO,STR,SNB,USFT
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- | 0.260" (6.60mm) | 16.000" (406.40mm) | Tin | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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CSTR COIL SNB
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Large Enclosure | 0.250" (6.35mm) | 25.000 (7.60m) | Tin | 299.21μin (7.60μm) | Hardware，Rivet，Solder | |||
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Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
CSTR COIL NIE
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Large Enclosure | 0.250" (6.35mm) | 25.000 (7.60m) | Nickel | 299.21μin (7.60μm) | Hardware，Rivet，Solder | |||
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Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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CSTR COIL NIB
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Large Enclosure | 0.250" (6.35mm) | 25.000 (7.60m) | Nickel | 299.21μin (7.60μm) | Hardware，Rivet，Solder | |||
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Laird Technologies EMI |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
CSTR COIL ZNY
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Large Enclosure | 0.250" (6.35mm) | 25.000 (7.62m) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Hardware，Rivet，Solder |
