- Material：
-
- Shape：
-
- Plating - Thickness：
-
- Attachment Method：
-
- Selected conditions:
Discover 5 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU PTAFG PU V0 REC
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.039" (1.00mm) | 0.118" (3.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
DCON,25P,SS
|
121°C | Fingerstock | Stainless Steel | - | 0.025" (0.64mm) | 0.690" (17.53mm) | - | - | Slot | ||
|
|
|
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
DCON,25P,BF
|
121°C | Fingerstock | Beryllium Copper | - | 0.025" (0.64mm) | 0.360" (9.14mm) | - | - | Slot | ||
|
|
|
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
DCON,25P,SNB
|
121°C | Fingerstock | Beryllium Copper | - | 0.025" (0.64mm) | 0.690" (17.53mm) | Tin | 299.21μin (7.60μm) | Slot | ||
|
|
|
Laird Technologies EMI |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
DCON,25P,BF
|
121°C | Fingerstock | Beryllium Copper | - | 0.025" (0.64mm) | 0.690" (17.53mm) | - | - | Slot |
