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- Number of Cores/Bus Width：
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- SATA：
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Discover 237 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
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NXP USA Inc. |
265
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3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | Yes | Keypad，LCD | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
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NXP USA Inc. |
1,520
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 1GHZ 400MAPBGA
|
Tray | i.MX6SX | -20°C ~ 105°C (TJ) | 400-LFBGA | 400-MAPBGA (14x14) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，1GHz | 2 Core，32-Bit | Multimedia; NEON® MPE | Yes | Keypad，LCD | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
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NXP USA Inc. |
1,129
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
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Tray | i.MX6S | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
230
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
1,424
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 529MAPBGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | 529-LFBGA | 529-MAPBGA (19x19) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | Yes | Keypad，LCD，LVDS | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
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NXP USA Inc. |
564
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MPU I.MX6SX 800MHZ 529MAPBGA
|
Tray | i.MX6SX | -40°C ~ 125°C (TJ) | 529-LFBGA | 529-MAPBGA (19x19) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | Yes | Keypad，LCD，LVDS | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
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NXP USA Inc. |
1,173
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | -20°C ~ 105°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
1,825
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 105°C (TA) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
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NXP USA Inc. |
446
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
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NXP USA Inc. |
911
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
292
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | -20°C ~ 105°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
499
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 800MHZ 624MAPBGA
|
Tray | i.MX6DL | -40°C ~ 105°C (TA) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
420
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1GHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
936
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D 800MHZ 624FCBGA
|
Tray | i.MX6D | -40°C ~ 105°C (TA) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
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NXP USA Inc. |
770
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
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NXP USA Inc. |
395
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
888
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU I.MX6D 1.0GHZ 624FCBGA
|
Tray | i.MX6D | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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|
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NXP USA Inc. |
592
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 800MHZ 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 105°C (TA) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
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NXP USA Inc. |
788
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
514
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection |
