- Manufacturer:
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- Series:
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- Package / Case:
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- Supplier Device Package:
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- Core Processor:
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- Voltage - I/O:
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- Speed:
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- Co-Processors/DSP:
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- RAM Controllers:
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- Display & Interface Controllers:
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- Ethernet:
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- USB:
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- Security Features:
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Discover 650 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | ||
NXP USA Inc. |
453
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 417MHZ 489BGA
|
Tray | MPC83XX | 489-LFBGA | 489-PBGA (19x19) | PowerPC e300c3 | 1.8V,3.3V | 417MHz | Communications; QUICC Engine | DDR2 | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||||
NXP USA Inc. |
1,825
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 800MHz | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
133
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 333MHZ 516BGA
|
Tray | MPC83XX | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V,2.5V,3.3V | 333MHz | Security; SEC 2.2 | DDR,DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | Cryptography | ||||
NXP USA Inc. |
734
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 400MHz | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | - | ||||
NXP USA Inc. |
440
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||||
NXP USA Inc. |
368
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
Tray | MPC82xx | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 450MHz | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||||
NXP USA Inc. |
98
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
Tray | MPC82xx | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 450MHz | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||||
Microchip Technology |
109
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 160KB ROM 324LFBGA
|
Tray | SAMA5D3 | 324-LFBGA | 324-LFBGA (15x15) | ARM® Cortex®-A5 | 1.2V,1.8V,3.3V | 536MHz | - | LPDDR,LPDDR2,DDR2 | No | LCD,Touchscreen | 10/100/1000 Mbps (1) | - | USB 2.0 (3) | AES,SHA,TDES,TRNG | ||||
NXP USA Inc. |
313
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V,1.8V,3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
420
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 400MHZ 473MAPBGA
|
Tray | MPC83XX | 473-LFBGA | 473-MAPBGA (19x19) | PowerPC e300c3 | 1.8V,2.5V,3.3V | 400MHz | - | DDR2 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 (1) | - | ||||
NXP USA Inc. |
761
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 800MHz | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
79
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 480TBGA
|
Tray | MPC82xx | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 333MHz | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||||
NXP USA Inc. |
63
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC74XX 1.267GHZ 360BGA
|
Tray | MPC74xx | 360-BCBGA,FCCBGA | 360-FCCBGA (25x25) | PowerPC G4 | 1.5V,1.8V,2.5V | 1.267GHz | Multimedia; SIMD | - | No | - | - | - | - | - | ||||
NXP USA Inc. |
2,324
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 369BGA
|
Tray | MPC83XX | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V,3.3V | 266MHz | Communications; QUICC Engine | DDR2 | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||||
NXP USA Inc. |
122
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | - | ||||
NXP USA Inc. |
102
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | Communications; RISC CPM,Security; SEC | DRAM,SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
101
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 400MHz | Communications; RISC CPM,Security; SEC | DRAM,SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
75
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 352TBGA
|
Tray | MPC82xx | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 3.3V | 333MHz | - | SDRAM | No | - | - | - | - | - | ||||
NXP USA Inc. |
360
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 400MHZ 489BGA
|
Tray | MPC83XX | 489-LFBGA | 489-PBGA (19x19) | PowerPC e300c3 | 1.8V,3.3V | 400MHz | Communications; QUICC Engine | DDR2 | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||||
NXP USA Inc. |
159
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tray | i.MX6SL | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V,1.8V,3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection |