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Discover 255 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
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NXP USA Inc. |
440
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MPU MPC82XX 266MHZ 516BGA
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Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
|
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Microchip Technology |
587
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB ROM 217BGA
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Tray | SAM9G | -40°C ~ 85°C (TA) | 217-LFBGA | 217-LFBGA (15x15) | ARM926EJ-S | 1.8V，3.3V | 1 Core，32-Bit | - | SDRAM，SRAM | No | LCD | - | - | USB 2.0 (2) | - | ||
|
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NXP USA Inc. |
1,260
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 473MAPBGA
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Tray | MPC83XX | 0°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | - | DDR2 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 (1) | - | ||
|
|
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NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
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Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
139
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 369BGA
|
Tray | MPC83XX | 0°C ~ 105°C (TA) | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 1 Core，32-Bit | Communications; QUICC Engine | DDR2 | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
|
|
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NXP USA Inc. |
2,324
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 369BGA
|
Tray | MPC83XX | -40°C ~ 105°C (TA) | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 1 Core，32-Bit | Communications; QUICC Engine | DDR2 | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
|
|
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NXP USA Inc. |
122
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | - | ||
|
|
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NXP USA Inc. |
102
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 1 Core，32-Bit | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
|
|
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NXP USA Inc. |
1,376
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 357BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 3.3V | 1 Core，32-Bit | - | SDRAM | No | - | - | - | - | - | ||
|
|
|
NXP USA Inc. |
265
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 352TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 3.3V | 1 Core，32-Bit | - | SDRAM | No | - | - | - | - | - | ||
|
|
|
NXP USA Inc. |
26
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 480TBGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | - | - | ||
|
|
|
NXP USA Inc. |
44
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 620BGA
|
Tray | MPC83XX | -40°C ~ 105°C (TA) | 620-BBGA Exposed Pad | 620-PBGA (29x29) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | - | DDR，DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | - | ||
|
|
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NXP USA Inc. |
9
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 620BGA
|
Tray | MPC83XX | 0°C ~ 105°C (TA) | 620-BBGA Exposed Pad | 620-PBGA (29x29) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | - | DDR，DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
12
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 480TBGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | - | - | ||
|
|
|
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LQFP
|
Tray | Vybrid，VF3xx | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | ARM® Cortex®-A5 | 3.3V | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | - | USB 2.0 OTG + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LQFP
|
Bulk | Vybrid，VF3xxR | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | ARM® Cortex®-A5 | 3.3V | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | No | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | - | USB 2.0 OTG + PHY (1) | ARM TZ，Hashing，RNG，RTC，RTIC，Secure JTAG，SNVS，TZ ASC，TZ WDOG | ||
|
|
|
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LQFP
|
Bulk | Vybrid，VF3xxR | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | ARM® Cortex®-A5 | 3.3V | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | No | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | - | USB 2.0 OTG + PHY (1) | ARM TZ，Hashing，RNG，RTC，RTIC，Secure JTAG，SNVS，TZ ASC，TZ WDOG | ||
|
|
|
NXP USA Inc. |
32
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 489BGA
|
Tray | MPC83XX | -40°C ~ 105°C (TA) | 489-LFBGA | 489-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 1 Core，32-Bit | Communications; QUICC Engine | DDR2 | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
80
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LQFP
|
Tray | Vybrid，VF3xx | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | ARM® Cortex®-A5 | 3.3V | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | - | USB 2.0 OTG + PHY (1) | ARM TZ，CAAM，HAB，RTIC，Secure JTAG，SNVS，Tamper，TZ ASC，TZ WDOG |
