- Packaging：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- RAM Size：
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Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | RAM Size | |
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NXP USA Inc. |
1,307
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT ROMLESS 324TEPBGA
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Tray | -40°C ~ 125°C (TJ) | 324-BBGA | 324-TEPBGA (23x23) | 64 | 32K x 8 | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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IC MCU 32BIT ROMLESS 324TEPBGA
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Tape & Reel (TR) | -40°C ~ 125°C (TJ) | 324-BBGA | 324-TEPBGA (23x23) | 64 | 32K x 8 | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
|
IC MCU 32BIT ROMLESS 324BGA
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Tape & Reel (TR) | -40°C ~ 125°C (TJ) | 324-BBGA | 324-PBGA (23x23) | 64 | 32K x 8 | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 40 MPQ: 1
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IC MCU 32BIT ROMLESS 516FPBGA
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Tray | 0°C ~ 70°C (TA) | 516-BBGA | 516-FPBGA (27x27) | 147 | 128K x 8 |
