Discover 10 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Series Operating Temperature Package / Case Supplier Device Package Number of I/O RAM Size
MPC5125YVN400
NXP USA Inc.
1,307
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT ROMLESS 324TEPBGA
Tray MPC51xx -40°C ~ 125°C (TJ) 324-BBGA 324-TEPBGA (23x23) 64 32K x 8
MPC5121YVY400B
NXP USA Inc.
196
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT ROMLESS 516FPBGA
Tray MPC5121e -40°C ~ 85°C (TA) 516-BBGA 516-FPBGA (27x27) 147 128K x 8
SPC5123YVY400B
NXP USA Inc.
Inquiry
-
-
MOQ: 1  MPQ: 1
TELEMATICS PROCESSOR W/O MBX GRA
Tray MPC5123 -40°C ~ 85°C (TA) 516-BBGA Exposed Pad 516-FPBGA (27x27) 147 128K x 8
MPC5125YVN400R
NXP USA Inc.
Inquiry
-
-
MOQ: 500  MPQ: 1
IC MCU 32BIT ROMLESS 324TEPBGA
Tape & Reel (TR) MPC51xx -40°C ~ 125°C (TJ) 324-BBGA 324-TEPBGA (23x23) 64 32K x 8
SPC5125YVN400R
NXP USA Inc.
Inquiry
-
-
MOQ: 500  MPQ: 1
IC MCU 32BIT ROMLESS 324BGA
Tape & Reel (TR) MPC51xx -40°C ~ 125°C (TJ) 324-BBGA 324-PBGA (23x23) 64 32K x 8
SPC5121YVY400B
NXP USA Inc.
Inquiry
-
-
MOQ: 200  MPQ: 1
IC MCU 32BIT ROMLESS 516TEPBGA
Tray MPC5121e -40°C ~ 85°C (TA) 516-BBGA Exposed Pad 516-TEPBGA (27x27) 147 128K x 8
MPC5123YVY400B
NXP USA Inc.
Inquiry
-
-
MOQ: 200  MPQ: 1
IC MCU 32BIT ROMLESS 516FPBGA
Tray MPC5123 -40°C ~ 85°C (TA) 516-BBGA 516-FPBGA (27x27) 147 128K x 8
MPC5121VY400B
NXP USA Inc.
Inquiry
-
-
MOQ: 200  MPQ: 1
IC MCU 32BIT ROMLESS 516FPBGA
Tray MPC5121e 0°C ~ 70°C (TA) 516-BBGA 516-FPBGA (27x27) 147 128K x 8
MPC5123VY400B
NXP USA Inc.
Inquiry
-
-
MOQ: 120  MPQ: 1
IC MCU 32BIT ROMLESS 516FPBGA
Tray MPC5123 0°C ~ 70°C (TA) 516-BBGA 516-FPBGA (27x27) 147 128K x 8
PPC5121VY400
NXP USA Inc.
Inquiry
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-
MOQ: 40  MPQ: 1
IC MCU 32BIT ROMLESS 516FPBGA
Tray MPC51xx 0°C ~ 70°C (TA) 516-BBGA 516-FPBGA (27x27) 147 128K x 8