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Discover 77 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | |
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NXP USA Inc. |
1,192
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM，WDT | HCS12 | 91 | 25MHz | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | ||
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NXP USA Inc. |
1,602
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 192KB FLASH 64LQFP
|
Tray | S12 MagniV | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA，POR，PWM，WDT | S12Z | 42 | 32MHz | 192KB (192K x 8) | 2K x 8 | 3.5 V ~ 40 V | A/D 16x12b，D/A 1x8b | Internal | ||
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NXP USA Inc. |
500
|
3 days |
-
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MOQ: 500 MPQ: 1
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IC MCU 16BIT 512KB FLASH 112LQFP
|
Tape & Reel (TR) | HCS12 | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM，WDT | HCS12 | 91 | 25MHz | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | ||
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NXP USA Inc. |
542
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Cut Tape (CT) | HCS12 | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM，WDT | HCS12 | 91 | 25MHz | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | ||
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NXP USA Inc. |
542
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
- | HCS12 | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM，WDT | HCS12 | 91 | 25MHz | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | ||
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NXP USA Inc. |
1,225
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | PWM，WDT | HCS12 | 59 | 25MHz | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | ||
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|
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NXP USA Inc. |
433
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM，WDT | HCS12 | 91 | 25MHz | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | ||
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|
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NXP USA Inc. |
718
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | PWM，WDT | HCS12 | 59 | 25MHz | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.25 V | A/D 8x10b | Internal | ||
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|
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NXP USA Inc. |
923
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM，WDT | HCS12 | 91 | 25MHz | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.25 V | A/D 8x10b | Internal | ||
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NXP USA Inc. |
499
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | PWM，WDT | HCS12 | 59 | 25MHz | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | ||
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|
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NXP USA Inc. |
285
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) | PWM，WDT | HCS12 | 59 | 25MHz | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | ||
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|
|
NXP USA Inc. |
366
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) | PWM，WDT | HCS12 | 59 | 25MHz | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.25 V | A/D 8x10b | Internal | ||
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|
|
NXP USA Inc. |
193
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM，WDT | HCS12 | 91 | 25MHz | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | ||
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NXP USA Inc. |
832
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 19
|
Tray | S12 MagniV | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA，POR，PWM，WDT | S12Z | 28 | 32MHz | 192KB (192K x 8) | 2K x 8 | 3.5 V ~ 40 V | A/D 10x10b，D/A 1x8b | Internal | ||
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NXP USA Inc. |
465
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MAGNIV 16-BIT MCU S12Z CORE 19
|
Tray | S12 MagniV | -40°C ~ 125°C (TA) | 48-LQFP | 48-LQFP (7x7) | DMA，POR，PWM，WDT | S12Z | 28 | 32MHz | 192KB (192K x 8) | 2K x 8 | 3.5 V ~ 40 V | A/D 10x12b，D/A 1x8b | Internal | ||
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|
NXP USA Inc. |
272
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM，WDT | HCS12 | 91 | 25MHz | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.25 V | A/D 8x10b | Internal | ||
|
|
|
NXP USA Inc. |
80
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM，WDT | HCS12 | 91 | 25MHz | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.25 V | A/D 8x10b | Internal | ||
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|
|
NXP USA Inc. |
44
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 80QFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) | PWM，WDT | HCS12 | 59 | 25MHz | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | ||
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|
NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 512KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM，WDT | HCS12 | 91 | 25MHz | 512KB (512K x 8) | 4K x 8 | 2.35 V ~ 5.25 V | A/D 16x10b | Internal | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 256KB FLASH 112LQFP
|
Tray | HCS12 | -40°C ~ 125°C (TA) | 112-LQFP | 112-LQFP (20x20) | PWM，WDT | HCS12 | 91 | 25MHz | 256KB (256K x 8) | 4K x 8 | 2.35 V ~ 5.25 V | A/D 8x10b | Internal |
